[News] ASMPT Reportedly Provided Demo TC Bonder to Micron for HBM Production

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Driven by memory giants ramping up high-bandwidth memory (HBM) production, according to a report from Korean media outlet TheElec, ASMPT, a back-end equipment maker, has supplied a demo thermal compression (TC) bonder for Micron’s HBM production.

TC bonders play a pivotal role in HBM production by employing thermal compression to bond and stack chips on processed wafers, thereby significantly influencing HBM yield.

ASMPT is reportedly collaborating with the US memory giant to co-develop a TC bonder for use in HBM4 production. Notably, ASMPT has supplied TC bonders to SK Hynix as well and plans to deliver more units later in the year.

Micron is also procuring TC bonders from Shinkawa and Hanmi Semiconductor for the production of HBM3e. However, as per the same report citing sources, Shinkawa has its handful in supplying the bonders to its largest customer, so Micron added Hanmi Semiconductor as a secondary supplier.

In addition to Micron, Samsung Electronics and SK Hynix have developed distinct supply chains for TC bonders. Samsung sources its equipment from Japan’s Toray and Sinkawa, as well as its subsidiary SEMES. In contrast, SK Hynix relies on Singapore’s ASMPT, HANMI Semiconductor, and Hanhwa Precision Machinery.

According to industry sources cited by The Chosun Daily, TC bonder orders driven by memory giants have been strong, as Samsung Electronics’ subsidiary SEMES has delivered nearly 100 TC bonders over the past year. Meanwhile, SK Hynix has inked a approximately $107.98 million contract with HANMI Semiconductor, which commands a 65% share of the TC bonder market.

Regarding the latest developments in HBM, TrendForce indicates that HBM3e will become the market mainstream this year, with shipments concentrated in the second half of the year. Currently, SK hynix remains the primary supplier, along with Micron, both utilizing 1beta nm processes and already shipping to NVIDIA.

According to TrendForce predictions, the annual growth rate of HBM demand will approach 200% in 2024 and is expected to double in 2025.

Read more

• [News] Rising HBM Production by Samsung and SK Hynix Energizes Korea’s TC Bonder Industry
• [News] Micron’s HBM Expansion at Full Throttle: Rumored to Expand in US, Malaysia Also an Option

(Photo credit: Micron)