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Monthly Archives: June 2023
Delay in Mass Production of Micro LED Apple Watch until 2026, According to Industry Sources
Apple has finally launched the Vision Pro, an MR device equipped with Micro OLED, but the debut of the Apple Watch with Micro LED panels has been repeatedly delayed. According to a report from TechNews, industry insiders revealed that the …
A Comprehensive Overview of Global Micro OLED Manufacturers
With the release of Apple’s Vision Pro, its Micro OLED display technology has caught the attention of more people. In fact, global Micro OLED display manufacturers have been working in this field for many years. In recent years, Chinese manufacturers …
AI and HPC Demand Set to Boost HBM Volume by Almost 60% in 2023, Says TrendForce
High Bandwidth Memory (HBM) is emerging as the preferred solution for overcoming memory transfer speed restrictions due to the bandwidth limitations of DDR SDRAM in high-speed computation. HBM is recognized for its revolutionary transmission efficiency and plays a pivotal role …
Posted in DRAM, Semiconductors, server
Tagged AI, AI chip, AI server, AIGC, ASIC, HBM
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Under the Hood: How is SiC Reshaping the Automotive Supply Chain?
The global automotive industry is pouring billions of dollars into SiC semiconductors, hoping that they could be key to transforming vehicle power systems. This shift is rapidly changing the supply chain at all levels, from components to modules. In the …
Posted in Automotive Technologies, Emerging Technologies, Semiconductors
Tagged EV, IGBT, Infineon, MOSFET, ON semi, ROHM, SiC, STMicroelectronics, Tesla, TPAK, Wolfspeed
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HBM and 2.5D Packaging: the Essential Backbone Behind AI Server
With the advancements in AIGC models such as ChatGPT and Midjourney, we are witnessing the rise of more super-sized language models, opening up new possibilities for High-Performance Computing (HPC) platforms. According to TrendForce, by 2025, the global demand for computational …
Posted in Emerging Technologies, Semiconductors, 未分類
Tagged 2.5D Packaging, ASE, CoWoS, HBM, Intel, Samsung, TSMC
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