Monthly Archives: July 2023

Over 20 Wafer Fabs Worldwide to Be Completed Year by Year, Will TSMC Establish a New 7nm Production Line in Japan?

According to sources cited by Nikkan Kogyo Shimbun, TSMC intends to commence the construction of the second fab in Kikuyo-cho, Kumamoto Prefecture, Japan, in April 2024, with the goal of commencing production before the end of 2026. It is worth …

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Memory Market Momentum Remains Unimproved, Spot Prices Continue to Decline

TrendForce has released the latest spot prices of memory, which have continued to decline due to the impact of the stagnant market conditions. Both DRAM and NAND Flash spot prices have dropped further. The details are as follows: DRAM Spot …

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EVs to Uncover the Gold Mine for High-Value PCBs

From foundational propulsion systems to cutting-edge autonomous driving, new technologies in modern electric vehicles(EVs) are increasingly leaning on advanced PCBs. In a state-of-the-art electric vehicle, chips on PCB control a broad range of functions from safety alerts to convenience systems. …

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ASE, Amkor, UMC and Samsung Getting a Slice of the CoWoS Market from AI Chips, Challenging TSMC

AI Chips and High-Performance Computing (HPC) have been continuously shaking up the entire supply chain, with CoWoS packaging technology being the latest area to experience the tremors. In the previous piece, “HBM and 2.5D Packaging: the Essential Backbone Behind AI …

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Stronger TV Panel Purchasing Momentum in July, According to TrendForce

TrendForce reported that TV panel purchases are gaining momentum in the early July, with both Chinese and other major brand customers increasing their orders in preparation for the busy promotional season in the second half of the year. Overall, the …

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