Monthly Archives: August 2023

[News] Asus AI Servers Swiftly Seize Business Opportunities

Posted on 2023-08-31 by TrendForce

According to the news from Chinatimes, Asus, a prominent technology company, has announced on the 30th of this month the release of AI servers equipped with NVIDIA’s L40S GPUs. These servers are now available for order. The L40S GPU was …

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[News] Continued Reduction in NAND Flash Production, Price Recovery Emerging

Posted on 2023-08-31 by TrendForce

According to a report from Taiwan’s TechNews, the NAND Flash industry is gradually recovering in pricing as suppliers continue to reduce production. However, achieving a healthy market balance in terms of supply, demand, and pricing is expected to require more …

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[News] Goldman Sachs: TSMC to Win Big with Intel’s Increased Outsourcing

Posted on 2023-08-31 by TrendForce

According to a report by Taiwan’s Commercial Times, Goldman Sachs Securities has noted that Intel has been consistently grappling with process upgrade delays since the 10-nanometer fabrication process. Recently, the company has decided to establish a foundry-like relationship between its …

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Understanding Chiplets, SoC, and SiP: Why TSMC, Intel, Samsung Invest?

Posted on 2023-08-31 by TrendForce

Semiconductor process technology is nearing the boundaries of known physics. In order to continually enhance processor performance, the integration of small chips (chiplets) and heterogeneous Integration has become a prevailing trend. It is also regarded as a primary solution for …

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[News] Huawei Mate 60’s Kirin 9000s: SMIC Production, Old Tech or US Restriction Break?

Posted on 2023-08-30 by TrendForce

According to a report by Taiwan’s TechNews, the Huawei Kirin 9000S mobile processor, dubbed by Chinese media as “4G technology with 5G speed,” was incorporated into the Huawei Mate 60 Pro smartphone on the 29th. The phone was made available …

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Posted in Consumer Electronics, IC Design, IC Manufacturing, Package&Test, Semiconductors, Smartphones | Tagged , , , , | Leave a comment