Monthly Archives: August 2023

[News] CoWoS Production Surges at TSMC, UMC, Amkor, and ASE Hasten to Catch Up

According to a report by Taiwan’s Commercial Times, JPMorgan’s latest analysis reveals that AI demand will remain robust in the second half of the year. Encouragingly, TSMC’s CoWoS capacity expansion progress is set to exceed expectations, with production capacity projected …

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[News] Samsung Leads in Unveiling BSPDN Research; TSMC and Intel Speed Up Deployment

As per a report from Taiwan’s TechNews,” TSMC, Samsung, and Intel have been actively deploying Backside Power Delivery Network (BSPDN) strategies recently, and have announced plans to incorporate BSPDN into their logic chip development roadmap. For instance, Samsung intends to …

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[News] TSMC’s 2nm Fab at CSTP Delayed to Next Year for Construction

According to a report from Taiwan’s Economic Daily, the construction of TSMC’s 2-nanometer fab in the Central Taiwan Science Park (CSTP) is confirmed to be delayed until next year due to land acquisition and construction timelines. The Taiwan Central Science …

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[News] Foxconn Secures Major NVIDIA Order, Leads in AI Chip Base Boards

According to a report by Taiwan’s Economic Daily, Foxconn Group has achieved another triumph in its AI endeavors. The company has secured orders for over 50% of NVIDIA’s HGX GPU base boards, marking the first instance of such an achievement. Adding …

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Micro OLED vs. Micro LED: Comparing AR Display Technologies

Apple has unveiled its long-awaited MR device, “Vision Pro,” which provides a clearer perspective on the potential and applications of AR devices. Despite not being as bulky as VR devices, Vision Pro still has a way to go before reaching …

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