Monthly Archives: August 2023

[News] SK Hynix Sets Milestone with 321-Layer NAND Flash Demonstration

SK Hynix, a semiconductor leader, announced a significant breakthrough in NAND flash technology on August 9 at the Flash Memory Summit in California. They introduced a pioneering 321-layer 1Tb TLC 4D NAND flash memory, marking a notable advancement in NAND …

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DDR4 Price Struggles as DDR5 Maintains Steady Ground in Early August

DRAM Spot Market Compared with last week, there are signs that the decline in DRAM spot prices is easing, but there has not been a noticeable increase in overall transaction volume. The spot market still has an abundant supply of …

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TrendForce Analysis: TSMC’s Ambitious ESMC Project Faces Global Labor Challenges and Regulatory Complexities

Leading semiconductor companies TSMC, Robert Bosch GmbH, Infineon, and NXP Semiconductors have jointly to invest in the European Semiconductor Manufacturing Company (ESMC) GmbH, situated in Dresden, Germany. This strategic move aims to bolster the region’s semiconductor manufacturing capabilities, particularly catering …

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AI GPU Bottleneck Explained: Causes and Prospects for Resolution

Charlie Boyle, Vice President of NVIDIA’s DGX Systems, recently addressed the issue of limited GPU production at the company. Boyle clarified that the current GPU shortage is not a result of NVIDIA misjudging demand or constraints in Taiwan Semiconductor Manufacturing …

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[News] Global Wafer Plants: Are Two More on the Horizon?

Leading semiconductor companies are making significant strides in global expansion with the announcement of two new fabrication facilities. TSMC is set to greenlight a factory in Germany, while GlobalFoundries plans to establish its first 12-inch wafer plant in Singapore. TSMC’s …

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