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Monthly Archives: August 2023
DDR4 Price Struggles as DDR5 Maintains Steady Ground in Early August
DRAM Spot Market Compared with last week, there are signs that the decline in DRAM spot prices is easing, but there has not been a noticeable increase in overall transaction volume. The spot market still has an abundant supply of …
TrendForce Analysis: TSMC’s Ambitious ESMC Project Faces Global Labor Challenges and Regulatory Complexities
Leading semiconductor companies TSMC, Robert Bosch GmbH, Infineon, and NXP Semiconductors have jointly to invest in the European Semiconductor Manufacturing Company (ESMC) GmbH, situated in Dresden, Germany. This strategic move aims to bolster the region’s semiconductor manufacturing capabilities, particularly catering …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged Bosch, ESMC, Infineon, NXP, TSMC
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AI GPU Bottleneck Explained: Causes and Prospects for Resolution
Charlie Boyle, Vice President of NVIDIA’s DGX Systems, recently addressed the issue of limited GPU production at the company. Boyle clarified that the current GPU shortage is not a result of NVIDIA misjudging demand or constraints in Taiwan Semiconductor Manufacturing …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged AMD, CoWoS, Google, HBM, Nvidia, TSMC
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[News] Global Wafer Plants: Are Two More on the Horizon?
Leading semiconductor companies are making significant strides in global expansion with the announcement of two new fabrication facilities. TSMC is set to greenlight a factory in Germany, while GlobalFoundries plans to establish its first 12-inch wafer plant in Singapore. TSMC’s …
Posted in Semiconductors, Wafer Foundries
Tagged foundry, GlobalFoundries, Intel, PSMC, TSMC, UMC, Vanguard
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An In-Depth Explanation of Advanced Packaging Technology: CoWoS
Over the past few decades, semiconductor manufacturing technology has evolved from the 10,000nm process in 1971 to the 3nm process in 2022, driven by the need to increase the number of transistors on chips for enhanced computational performance. However, as …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 5G, advanced packaging, AI, AIGC, CoWoS, HBM, HPC, IoT, TSMC, TSV
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