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Monthly Archives: September 2023
[News] Taiwan Micron Focuses on HBM Advanced Process and Packaging
According to Taiwan’s TechNews report, Lu Donghui, Chairman of Micron Technology Taiwan, stated that in response to the growing demand in the AI market, Micron Technology Taiwan will continue to invest in advanced processes and packaging technologies to produce High …
Posted in DRAM, IC Manufacturing, Package&Test, Semiconductors
Tagged HBM, Intel, Micron, Samsung, TSMC
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[News] Chiang Shang-yi, Former TSMC Co-COO, Shares China Experience and CoWoS Development
According to Taiwan’s TechNews report, Chiang Shang-yi, former TSMC Co-COO and current Chief Semiconductor Strategist at Foxconn, shared insights during a Taiwan Television interview. He discussed his past role at TSMC, the potential impact of U.S. export restrictions on China’s …
[News] Amid Uncertain Market, TSMC to Avoid Supplier Price Cuts Next Year
According to a report from Taiwan’s TechNews, as we approach the fourth quarter, which marks the peak period for negotiations between the semiconductor manufacturing leader TSMC and its suppliers, the supply chain is indicating that TSMC is expected to follow …
[News] Huawei’s Return to the Market with Kirin 9000S Processor Expected to Impact the Smartphone Market
According to a report from Taiwan’s TechNews, Huawei’s Mate 60 Pro smartphone, powered by its in-house Kirin 9000S processor, quietly appeared on the market recently, testing has shown that its network speed approaches that of 5G. This development has sparked …
Posted in Consumer Electronics, IC Design, IC Manufacturing, Package&Test, Semiconductors, Smartphones
Tagged Huawei, Kirin 9000s, Mate 60 Pro, SMIC
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[News] Wistron Secures Both NVIDIA and AMD AI Server Orders
According to a report by Taiwan’s Commercial Times, Wistron AI server orders are surging. Following their successful acquisition of orders for NVIDIA’s next-generation DGX/HGX H100 series AI server GPU baseboards, there are industry sources suggesting that Wistron has secured orders …