Monthly Archives: September 2023

[News] Taking NVIDIA Server Orders, Inventec Expands Production in Thailand

Posted on 2023-09-05 by TrendForce

According to Taiwan’s Liberty Times, in response to the global supply chain restructuring, electronic manufacturing plants have been implementing a “China+ N” strategy in recent years, catering shipments to customers in different regions. Among them, Inventec continues to strengthen its …

Continue reading →
Posted in Semiconductors, server | Tagged , | Leave a comment

[News] Taiwan Micron Focuses on HBM Advanced Process and Packaging

Posted on 2023-09-05 by TrendForce

According to Taiwan’s TechNews report, Lu Donghui, Chairman of Micron Technology Taiwan, stated that in response to the growing demand in the AI market, Micron Technology Taiwan will continue to invest in advanced processes and packaging technologies to produce High …

Continue reading →
Posted in DRAM, IC Manufacturing, Package&Test, Semiconductors | Tagged , , , , | Leave a comment

[News] Chiang Shang-yi, Former TSMC Co-COO, Shares China Experience and CoWoS Development

Posted on 2023-09-04 by TrendForce

According to Taiwan’s TechNews report, Chiang Shang-yi, former TSMC Co-COO and current Chief Semiconductor Strategist at Foxconn, shared insights during a Taiwan Television interview. He discussed his past role at TSMC, the potential impact of U.S. export restrictions on China’s …

Continue reading →
Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , , | Leave a comment

[News] Amid Uncertain Market, TSMC to Avoid Supplier Price Cuts Next Year

Posted on 2023-09-04 by TrendForce

According to a report from Taiwan’s TechNews, as we approach the fourth quarter, which marks the peak period for negotiations between the semiconductor manufacturing leader TSMC and its suppliers, the supply chain is indicating that TSMC is expected to follow …

Continue reading →
Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged | Leave a comment

[News] Huawei’s Return to the Market with Kirin 9000S Processor Expected to Impact the Smartphone Market

Posted on 2023-09-04 by TrendForce

According to a report from Taiwan’s TechNews, Huawei’s Mate 60 Pro smartphone, powered by its in-house Kirin 9000S processor, quietly appeared on the market recently, testing has shown that its network speed approaches that of 5G. This development has sparked …

Continue reading →
Posted in Consumer Electronics, IC Design, IC Manufacturing, Package&Test, Semiconductors, Smartphones | Tagged , , , | Leave a comment