-
Recent Posts
- [News] Japan’s Rapidus to Receive First EUV in mid-December, with ASML Planning Service Center Nearby
- [News] TSMC Reports Progress on Arizona Fab, No Completion Ceremony Planned
- [News] China’s Leading Chip Packaging Firm JCET Unveils Major Board Restructuring
- [News] Intel Israel Reportedly Sees Departure of Over 1,000 Employees amid Major Layoffs
- [News] China’s AI Unicorn Moore Threads, Domestic Competitor to NVIDIA, Kicks off IPO Process
Recent Comments
Archives
- November 2024
- October 2024
- September 2024
- August 2024
- July 2024
- June 2024
- May 2024
- April 2024
- March 2024
- February 2024
- January 2024
- December 2023
- November 2023
- October 2023
- September 2023
- August 2023
- July 2023
- June 2023
- May 2023
- April 2023
- March 2023
- February 2023
- January 2023
- December 2022
- November 2022
- October 2022
- September 2022
- August 2022
- July 2022
- June 2022
- May 2022
- April 2022
- March 2022
- February 2022
- January 2022
- December 2021
- November 2021
- October 2021
- September 2021
- August 2021
- July 2021
- June 2021
- May 2021
- April 2021
- March 2021
- February 2021
- January 2021
Categories
- 5G Technologies
- AR / VR
- Artificial Intelligence
- Automotive Technologies
- Broadband & Home Network
- Cloud / Edge Computing
- Consumer Electronics
- DataTrack-EN
- Display
- Display Supply Chain
- Display Technologies
- DRAM
- Emerging Technologies
- Energy
- IC Design
- IC Manufacturing, Package&Test
- Industry 4.0
- IoT
- IR LED / VCSEL / LiDAR Laser
- LCD
- LED
- LED Backlight
- LED Demand / Supply Data Base
- LED Display
- LED Lighting
- Lithium Battery and Energy Storage
- Macroeconomics
- Market Today
- Micro LED / Mini LED
- Monitors / AIO
- NAND Flash
- Notebook Computers
- OLED
- Others
- Panel Industry
- Semiconductors
- server
- Smartphones
- Solar PV
- Tablets
- Telecommunications
- TVs
- Upstream Components
- Wafer Foundries
- Wearable Devices
- 未分類
Meta
Monthly Archives: September 2023
[News] TSMC’s 3nm Wins Big Qualcomm 5G Deal, Outshines Samsung, Intel
According to a report from Taiwan’s Economic Daily, TSMC’s 3-nanometer technology has attracted another heavyweight client. Following Apple and MediaTek, it is rumored that Qualcomm will also commission TSMC to produce its next-generation 5G flagship chip using the 3-nanometer process. …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 3nm, Intel, Qualcomm, Samsung, TSMC
Leave a comment
[News] TSMC Deploys Manpower to Support Longtan and Tainan Facilities Amid CoWoS and 3nm Demand
According to Taiwan’s Money DJ, the AI wave is showing no signs of slowing down. Led by NVIDIA, major players including AMD, Intel, and international chip giants are aggressively entering the AI arena, driving increasing demand for advanced packaging and …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 3nm, AMD, CoWoS, Intel, Nvidia, TSMC
Leave a comment
[News] TSMC’s 3nm Capacity Hits 100,000 Wafers Next Year, Driven by New Projects
According to a report by Taiwan’s Money DJ, there’s good news from TSMC regarding its 3nm node. Sources within the supply chain have disclosed that the number of new chip designs using the 3nm process, known as “New Tape-Outs” (NTOs), …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 3nm, AMD, MediaTek, Nvidia, TSMC
Leave a comment
[News] UMC and ASE Weigh Price Increases in Booming Advanced Packaging Market
According to a report by Taiwan’s Economic Daily, TSMC is aggressively expanding its advanced packaging capacity. Recently, they placed an additional 30% order for equipment with manufacturers, leading to a doubling of order volumes for companies in the interposer supply …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged advanced packaging, ASE, CoWoS, Nvidia, UMC
Leave a comment
[News] TSMC’s Advanced Packaging Sees Surge with Rush Orders from NVIDIA, AMD, Amazon
According to a report by Taiwan’s Economic Daily, TSMC’s CoWoS advanced packaging capacity is running at full throttle. As they actively expand their production capabilities, there are reports of major customers like NVIDIA increasing their orders for AI chips. Additionally, …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged Amazon, AMD, CoWoS, Nvidia, TSMC
Leave a comment