Monthly Archives: September 2023

[News] Major Production Cuts and Inventory Clearance Fuel Q4 Memory Price Optimism

Posted on 2023-09-26 by TrendForce

According to Taiwan’s TechNews, with the ongoing reduction in production by major memory manufacturers and the visible benefits of inventory clearance in the market, NAND Flash prices are beginning to rebound, and DRAM prices are expected to follow suit. This …

Continue reading →
Posted in DRAM, IC Design, Semiconductors | Tagged , | Leave a comment

[News] TSMC’s 3nm Wins Big Qualcomm 5G Deal, Outshines Samsung, Intel

Posted on 2023-09-26 by TrendForce

According to a report from Taiwan’s Economic Daily, TSMC’s 3-nanometer technology has attracted another heavyweight client. Following Apple and MediaTek, it is rumored that Qualcomm will also commission TSMC to produce its next-generation 5G flagship chip using the 3-nanometer process. …

Continue reading →
Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , , , , | Leave a comment

[News] TSMC Deploys Manpower to Support Longtan and Tainan Facilities Amid CoWoS and 3nm Demand

Posted on 2023-09-25 by TrendForce

According to Taiwan’s Money DJ, the AI wave is showing no signs of slowing down. Led by NVIDIA, major players including AMD, Intel, and international chip giants are aggressively entering the AI arena, driving increasing demand for advanced packaging and …

Continue reading →
Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , , , , , | Leave a comment

[News] TSMC’s 3nm Capacity Hits 100,000 Wafers Next Year, Driven by New Projects

Posted on 2023-09-25 by TrendForce

According to a report by Taiwan’s Money DJ, there’s good news from TSMC regarding its 3nm node. Sources within the supply chain have disclosed that the number of new chip designs using the 3nm process, known as “New Tape-Outs” (NTOs), …

Continue reading →
Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , , , , | Leave a comment

[News] UMC and ASE Weigh Price Increases in Booming Advanced Packaging Market

Posted on 2023-09-25 by TrendForce

According to a report by Taiwan’s Economic Daily, TSMC is aggressively expanding its advanced packaging capacity. Recently, they placed an additional 30% order for equipment with manufacturers, leading to a doubling of order volumes for companies in the interposer supply …

Continue reading →
Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , , , , | Leave a comment