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Monthly Archives: December 2023
[News] Samsung Reportedly to Open New Research Lab for Advanced Packaging in Yokohama, with a Total Investment of JPY 40 Billion
Following TSMC’s first plant built in Japan’s Kumamoto Prefecture, Samsung has also chosen Yokohama as the location for its new facility in Japan. According to Japanese media NHK’s report, South Korean Samsung Electronics has decided the establishment of a new semiconductor …
[News] Intel CEO Indicated Intel’s 18A Slightly Ahead of TSMC’s N2
Intel CEO Pat Gelsinger has discussed around Intel’s process status, comparisons with TSMC in a recent interview. According to Barron’s report, Gelsinger mentioned in the interview that Intel’s 18A process and TSMC’s N2 process seem comparable, with no significant advantage …
[News] TSMC’s Arizona Plant Rumored for Q1 2024 Trial Production, Securing Orders from Three U.S. Clients
According to a report by TechNews, TSMC’s Arizona-based Fab21, currently in the intensive equipment installation phase, has initiated the construction of a small-scale trial production line. With a small amount of equipment expected from multiple supply chain by the end …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged AMD, Apple, Intel, TSMC
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[News] Micron Technology’s Strong Fiscal Report and AI Server Demand Surge
Micron Technology, the U.S. memory giant, has surpassed Wall Street expectations in its projected revenue for the current quarter (December-February). The main factor contributing to this success is the robust demand from data centers, offsetting the sluggish recovery in the …
[News] NVIDIA’s China-Exclusive GeForce RTX 4090 D Rumored to be Launched on December 28th
In response to export restrictions on AI chips by the U.S. Department of Commerce, NVIDIA has previously introduced a China-Exclusive version of its graphics card, featuring the AD102-250 GPU and named GeForce RTX 4090 D. According to ICsmart’s report, industry …