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Monthly Archives: December 2023
[News] Unexpected Retirement Announcement ‘Mark’ed! Challenges Ahead for TSMC After Mark Liu Steps Down as Chairman
TSMC announced yesterday that Chairman Mark Liu will retire after the shareholders’ meeting in June 2024, and it is possible that CEO C.C. Wei will succeed him as chairman, according to TechNews. While the news shocked the industry, insiders see …
[News] Apple Supplier Qorvo Sells Chinese Test and Packaging Plant to Luxshare
The global provider of connectivity and power solutions Qorvo announced that it has reached a definitive agreement with Luxshare Precision for the acquisition of Qorvo’s assembly and test facilities in Beijing and Dezhou, China. According to Qorvo’s official news, the …
[News] TSMC Chairman Mark Liu to Retire; C.C.Wei Recommended to Succeed
TSMC today announced that its Chairman Dr. Mark Liu has decided not to seek the nomination of TSMC board membership for the next term and will retire from the Company after the 2024 Annual Shareholders Meeting. TSMC’s Nominating, Corporate Governance …
[News] Chinese Semiconductor Design Industry Diverts to Malaysia to Evade U.S. Controls; Potential Advanced Packaging Orders Surge for ASE
An increasing number of Chinese semiconductor design companies are seeking collaboration with testing and packaging facilities in Malaysia to carry out advanced chip packaging. According to Reuters’ report, this move aims to hedge the risk of potential expanded U.S. restrictions …
Posted in Semiconductors, Wafer Foundries
Tagged China, export restriction, Malaysia, semiconductor, US
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[News] TSMC’s 7th Advanced Packaging and Testing Plant Likely to Settle in Yunlin or Chiayi
Following Intel’s move to split its outsourced foundry model, TSMC is gearing up to expand its advanced manufacturing processes in Taiwan, ready to face the competition head-on. According to China Time’s report, following the equipment first tool-in at the 2nm fab in …