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Monthly Archives: January 2024
[News] NVIDIA’s China-exclusive Chip H20 to Begin Production in Q2 by Wistron
In October of 2023, the U.S. government expanded its restrictions on chip exports, limiting NVIDIA from exporting certain chips to China without prior permission. Despite this, NVIDIA is not expected to relinquish the Chinese market and may commence production of the …
[News] TSMC Reportedly Attracts Influx of 3nm Customers, Predicts Production Capacity Utilization to Surge to 80% by Year-End
With its 3nm manufacturing process in mass production for approximately a year, TSMC is expected to have a breakthrough in customer acquisition and capacity utilization in 2024. According to predictions from a South Korean outlet The Elec, aside from Apple, customers such …
[News] Chinese Supply Chain Reports Vision Pro to Launch on January 27
During last year’s WWDC conference, Apple unveiled its first-ever head-mounted display product, the Vision Pro. At that time, the official statement mentioned a scheduled market release in early 2024, prompting speculation about the precise launch date of Vision Pro. According …
Posted in AR / VR, Consumer Electronics, Emerging Technologies, Wearable Devices
Tagged Vision Pro
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[News] Rumors Suggest TSMC’s Third Plant in Japan Likely to Be Located in Yokohama or Osaka
In 2024, TSMC’s global expansion continues at full throttle, with industry reports suggesting a significant breakthrough in the establishment of a 3-nanometer advanced process manufacturing facility in Japan. Osaka is considered the most likely location for TSMC’s third plant in …
[News] AMD Eyes CoWoS-like Supply for AI Chips with TSMC Full Capacity
TSMC operates at full capacity, AMD aims for AI chips reportedly seeks CoWoS-like supply chain. In 2023, NVIDIA led the global AI chip development, and in 2024, the global demand for AI chips is expected to continue to surge due …
Posted in IC Design, IC Manufacturing, Package&Test, Semiconductors
Tagged AMD, Amkor, ASE, CoWoS, MI300, TSMC
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