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Recent Posts
- [News] SK hynix Rumored to Deliver Major HBM Order to Broadcom in 2025
- [News] TSMC Rumored to Begin FOPLP Production with Smaller Substrates, with Mini Lines Prepared by 2026
- [News] Kioxia Urges Bain and Toshiba to Sell Shares, Aims to Double AI NAND Market Share in Three Years
- [News] NVIDIA Reportedly Asks Super Micro to Investigate AI Chips Acquired by China Following U.S. Demand
- [News] Intel Reportedly Narrows down Bidders for Altera, with Formal Offers Due by January’s End
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Monthly Archives: January 2024
[Insights] Memory Spot Price Trends: Clear Surge in DRAM; NAND Flash Relatively Calm
According to TrendForce’s latest report on memory spot price trends, the DRAM spot market is experiencing a clear upward trend driven by contract market demand. In contrast, the NAND Flash market appears relatively sluggish. Details are as follows: DRAM Spot …
[News] OpenAI Reportedly Expected to Gather with Samsung and SK Group for Deepened Chip Collaboration
Sam Altman, the CEO of OpenAI, the developer of the ChatGPT, is reportedly expected to visit Korea on January 26th. Altman may hold meetings with top executives from Samsung Electronics and SK Group to strengthen their collaboration on High-Bandwidth Memory …
[News] New Focus in the US-China Tech War! Can China Overtake with Silicon Photonics?
The Center for Strategic and International Studies (CSIS) in the United States published a new article on the January 12th, 2024, suggesting that the new battleground in the US-China tech war could be silicon photonics technology. This technology aims to …
[New] The Reality of Micro LED Unveiled – Infinite Opportunities, Yet Initial Capacity Demand Remains Low
Ennostar, a Taiwanese group focusing on the R&D and manufacturing of Micro LED, LED and compound semiconductor, has announced on January 19th a NTD 670 million (roughly USD 21.36 million) sale of the planned Micro LED production facility in Zhunan, Taiwan. …
Posted in Optical Semiconductors
Tagged Apple, AUO, Ennostar, Epistar, Micro LED, Samsung
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[News] Subsidies from the U.S. Legislation “NAPMP” Potentially Expected to Cover IC Substrates
The U.S. Department of Commerce has initiated the “National Advanced Packaging Manufacturing Program (NAPMP) ,” with materials and substrates being the first subsidized areas. Due to the close collaboration between IC testing and IC substrates, it is not ruled out …