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Monthly Archives: February 2024
[News] Chinese Clients Accept Price Hikes, DRAM Prices Rise for Three Consecutive Months
DRAM prices have risen for three consecutive months, a trend attributed to Chinese clients accepting the price hike requests from memory manufacturers, as reported by Nikkei on February 16th. As per data cited by Nikkei, the wholesale price (transaction price) …
[News] TSMC Reportedly Doubles CoWoS Capacity while Amkor, ASE also Enter Advanced Packaging for AI
The surge in demand for advanced packaging is being primarily propelled by artificial intelligence (AI) chips. According to industry sources cited by CNA, TSMC’s CoWoS production capacity is set to double this year, yet demand continues to outstrip supply. In …
[News] SoftBank Founder Masayoshi Son Plans to Raise USD 100 Billion to Establish AI Chip Company
SoftBank Group founder Masayoshi Son, as per a report from Bloomberg, is planning to raise USD 100 billion to establish an AI chip company, aiming to complement the group’s ARM business. The report indicates that Masayoshi Son plans to name the …
[News] CoWoS Capacity Shortage Challenges AI Chip Demand, while Taiwanese Manufacturers Expand to Seize Opportunities
With the flourishing development of technologies such as AI, cloud computing, big data analytics, and mobile computing, modern society has an increasingly high demand for computing power. Moreover, with the advancement beyond 3 nanometers, wafer sizes have encountered scaling limitations …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged advanced packaging, ASE Group, CoWoS, GPU, HBM, Nvidia, TSMC, UMC, winbo
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[News] High Efficiency in TSMC Kumamoto Plant Construction Sets Stage for Potential Advanced Packaging Investment in Japan
Industry sources cited by the Liberty Times Net have pointed out that the Kumamoto plant holds significant importance for both Taiwan and Japan, as Japan is expected to look for attracting investments from TSMC, Intel, and Samsung to establish manufacturing …
Posted in Semiconductors
Tagged advanced packaging, Japan, Kumamoto, semiconductor, TSMC
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