Monthly Archives: March 2024

[News] Speculations Arise on Samsung’s Partnership with Meta, Potentially Tapping into TSMC’s Client Base

As Samsung’s foundry business closely trails TSMC, Economic Daily News has reported that Samsung is poised to secure orders for Meta’s next-gen AI chips, manufactured on a 2-nanometer process. If so, this may mark Samsung’s first 2nm customer, intensifying the …

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[News] SK Hynix Reportedly Invests USD 1 Billion in Advanced Packaging to Strengthen HBM Chip Leadership

South Korean memory giant SK Hynix is significantly investing in advanced chip packaging, aiming to capture more demand for High Bandwidth Memory (HBM), a vital component driving the burgeoning AI market. According to Bloomberg’s report, Lee Kang-Wook, currently leading SK Hynix’s packaging …

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[News] Tower Semiconductor Reportedly Halting Operations for Three Weeks

Amid industry slowdown, customers are reducing orders as they are currently clearing inventory accumulated over the past two years due to semiconductor supply constraints. Thus, Tower Semiconductor reportedly plans a three-week shutdown for most of its operations in Newport Beach, California, …

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[News] Subsidies to TSMC from Japan and China Increase Over Fivefold Annually

Geopolitical factors are driving countries to actively establish semiconductor manufacturing locally and offer subsidies. According to TSMC’s annual report, subsidies received from Japan and China amounted to NTD 47.545 billion in 2023, signaling a 5.74-fold increase from the previous year, …

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[News] TSMC to Expand Production with New Facilities Across Taiwan in April

In response to the high demand for AI chips, TSMC has once again initiated a large-scale expansion in northern, central, and southern Taiwan. This expansion includes the first tool-in and the construction of 2-nanometer fabs and advanced packaging plants. Industry …

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