Monthly Archives: March 2024

[News] MediaTek Partners with Ranovus to Enter Niche Market, Expands into Heterogeneous Integration Co-Packaged Optics Industry

MediaTek has reportedly made its foray into the booming field of Heterogeneous Integration Co-Packaged Optics (CPO), announcing on March 20th a partnership with optical communications firm Ranovus to launch a customized Application-Specific Integrated Circuit (ASIC) design platform for CPO. This …

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[News] NVIDIA CEO Jensen Huang Estimates Blackwell Chip Price Around USD 30,000 to USD 40,000

With the Blackwell series chips making a splash in the market, pricing becomes a focal point. According to Commercial Times citing sources, Jensen Huang, the founder and CEO of NVIDIA, revealed in a recent interview that the price range for …

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[News] US Considers Sanctioning Huawei-Linked Chinese Chip Network, Huawei-Related Enterprises Blacklisted

According to Bloomberg citing sources, the US government is considering adding Chinese semiconductor companies linked to Huawei to a blacklist. This move comes after Huawei made significant breakthroughs in technology last year, indicating a potential escalation in US efforts to …

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[News] Blackwell Enters the Scene – A Closer Look at TSMC’s CoWoS Branch

NVIDIA unveiled its Blackwell architecture and the touted powerhouse AI chip GB200 at GTC 2024 held in San Jose, California, on March 19th. Manufactured using TSMC’s 4-nanometer (4NP) process, it is expected to ship later this year. According to a …

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[Insights] March Panel Prices Update, TV Brands Further Increased, Notebook Panel Prices Await Clear Direction

TrendForce has released the latest panel quotations for late March. TV panel prices further grew due to the increasing purchasing power; monitor panel demand continue to rise, surpassing expectations; for notebook panel, the lack of clarity in demand release has …

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