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Recent Posts
- [News] Former Intel CEO Pat Gelsinger Becomes an Investor for UK AI Startup Fractile
- [News] U.S. Blockade Fails? China’s Chip Exports Surge for 14 Consecutive Months, Hitting USD 160 Billion in 2024
- [News] Mitsubishi Motors Reportedly Won’t Join Honda-Nissan Integration, Focusing on Southeast Asia Growth
- [News] TSMC Reportedly Expects Fab 18 Recovery by Jan. 23, Fab 14 Timeline Uncertain After 6.4 Earthquake
- [News] TrendForce: China’s Trade-In Policy Continues, Driving January TV Panel Price Increases
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Monthly Archives: March 2024
[News] Bulgaria Launches Renewables Energy & Storage Tenders
The Ministry of Energy in Bulgaria has launched 2 separate calls to build new renewable energy capacity and energy storage facilities in the country with more than BGN 535 million (roughly USD 298 million) budget. The BG-RRP-4.032 tender will support …
[News] Understanding 3DIC, Heterogeneous Integration, SiP, and Chiplets at Once
The semiconductor industry enters the era of integration. Various foundries are focusing on advanced packaging technologies, but the terminology surrounding advanced packaging can be daunting. This article aims to explain these terms in the simplest way possible. According to a …
Posted in Semiconductors
Tagged 2.5D Packaging, 3D Packaging, 3D-IC, advanced process, chiplet, Heterogeneous Integration, SiP, SoC
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[News] Increasing Pressure on IDM 2.0 May Lead Intel to Delay or Abandon Investment Plans in Italy and France
In 2022, Intel engaged in negotiations with the Italian government, planning to invest USD 5 billion in constructing a packaging and testing facility. This project would also receive subsidies from the Italian government, expected to cover 40% of the construction …
[News] TSMC’s 4nm Process Powers NVIDIA’s Blackwell Architecture GPU, AI Performance Surpasses Previous Generations by Multiples
Chip giant NVIDIA kicked off its annual Graphics Processing Unit (GPU) Technology Conference (GTC) today, with CEO Jensen Huang announcing the launch of the new artificial intelligence chip, Blackwell B200. According to a report from TechNews, this new architecture, Blackwell, …
Posted in Semiconductors
Tagged AI chip, Blackwell, GPU, GTC, HBM3e, Nvidia, SK Hynix
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[News] Global Silicon Carbide Production Expansion Steps up
Benefited from robust demand in downstream application markets, the silicon carbide (SiC) industry is in high gear. According to TrendForce, the SiC power device market is expected to reach USD 5.33 billion by 2026, with its mainstream applications still highly …
Posted in Semiconductors
Tagged Ascen Power, Mersen, Mitsubishi Electric, SiC, Silicon Carbide
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