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Monthly Archives: March 2024
[News] The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?
“It is not the shortage of AI chips, it is the shortage of our CoWoS capacity,” replied TSMC Chairman Mark Liu during an interview in September last year, propelling this technology that TSMC had quietly cultivated for over a decade …
Posted in Semiconductors
Tagged advanced packaging, ASE Group, CoWoS, SPIL, Taiwan, TSMC
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[News] Bulgarian SUNOTEC Signed a Contract with Huawei to Promote the Application of Battery Energy Storage Technology in Europe
EPC SUNOTEC, a leading company of PV and energy storage station in Europe, and Huawei Technologies Bulgaria signed a memorandum of understanding on energy storage in Shenzhen to jointly promote the application of battery energy storage technology in Europe. Huawei has accumulation …
[News] Following February’s Advance Production of HBM3e, Micron Reportedly Secures Order from NVIDIA for H200
According to a report from the South Korean newspaper “Korea Joongang Daily,” following Micron’s initiation of mass production of the latest high-bandwidth memory HBM3e in February 2024, it has recently secured an order from NVIDIA for the H200 AI GPU. …
[News] Samsung NAND Flash Prices Reportedly Set to Increase by 20%
According to a report by the South Korean news outlet The Chosun Daily, Samsung Electronics’ memory business has managed to endure the market downturn from last year. Recently, its strategy of reducing production has finally paid off, driving up chip …
[News] Three-way Contest for HBM Dominance, Uncertainties Surrounding China’s Supply Chain Involvement
With numerous cloud computing companies and large-scale AI model manufacturers investing heavily in AI computing infrastructure, the demand for AI processors is rapidly increasing. As per a report from IJIWEI, the demand for HBM (High Bandwidth Memory), a key component …