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Monthly Archives: March 2024
[News] TSMC Reportedly Considering Establishment of Advanced Packaging Facility in Japan
According to sources cited by Reuters, TSMC is reportedly considering plans to establish a production line for its CoWoS technology in Japan. However, TSMC has yet to make any further decisions, and they have declined to comment on the matter. …
[News] TSMC Boosts Investment in Advanced Packaging with NTD 500 Billion Plan to Build Six Plants in Chiayi Science Park
The Executive Yuan and TSMC have reportedly reached a consensus on the investment project for the new advanced packaging plant at the TSMC Science Park in Chiayi. According to a report from Economic Daily News, six new plant sites will …
[News] The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?
“It is not the shortage of AI chips, it is the shortage of our CoWoS capacity,” replied TSMC Chairman Mark Liu during an interview in September last year, propelling this technology that TSMC had quietly cultivated for over a decade …
Posted in Semiconductors
Tagged advanced packaging, ASE Group, CoWoS, SPIL, Taiwan, TSMC
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[News] Bulgarian SUNOTEC Signed a Contract with Huawei to Promote the Application of Battery Energy Storage Technology in Europe
EPC SUNOTEC, a leading company of PV and energy storage station in Europe, and Huawei Technologies Bulgaria signed a memorandum of understanding on energy storage in Shenzhen to jointly promote the application of battery energy storage technology in Europe. Huawei has accumulation …
[News] Following February’s Advance Production of HBM3e, Micron Reportedly Secures Order from NVIDIA for H200
According to a report from the South Korean newspaper “Korea Joongang Daily,” following Micron’s initiation of mass production of the latest high-bandwidth memory HBM3e in February 2024, it has recently secured an order from NVIDIA for the H200 AI GPU. …