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Monthly Archives: April 2024
[News] TSMC Receives USD 6.6 Billion for Chipmaking from the US Government, Commits to Constructing Third Fab
The U.S. government officially announced today that it will provide a USD 6.6 billion subsidy to TSMC, and in its latest press release, confirmed that TSMC will build its third fab in Arizona, USA, with total investment rising to USD …
[News] Apple Reportedly Joins the Foldable Phone Market, Setting Stage for Three-Way Competition
Currently, the global foldable phone market is dominated by non-Apple players, with Samsung and Huawei acting as the key players, continuously expanding their related product lines. Although Apple has yet to debut any foldable hardware, rumors cited by a report …
[News] TSMC’s Advanced Processes Remain Resilient Amid Challenges
As TSMC’s earnings call approaches on April 18th, according to a source cited in a report from Commercial Times, it has predicted a downturn in the smartphone industry as it enters a slow season. However, TSMC is reportedly benefiting from AI demand, …
[News] While TSMC’s CoWoS Faces Supply Shortage, Samsung Reportedly Secures NVIDIA’s 2.5D Advanced Packaging Order
According to a report from South Korean media outlet TheElec, Samsung’s Advanced Package (AVP) team has reportedly secured an advanced packaging order for NVIDIA’s AI chip, paving the way for future supply of NVIDIA’s high-bandwidth memory (HBM) chips. The report, citing …
[News] TSMC’s Latest Statement Indicates Equipment Largely Recovered, Revenue Forecast Unchanged
According to TechNews, TSMC announced its latest updates on the evening of the 5th, stating that equipment within its Taiwan wafer fabs has largely recovered. The company’s full-year performance outlook, denominated in USD, is expected to remain consistent with the …