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Monthly Archives: April 2024
[News] Infineon Partners with Amkor to Establish Packaging and Testing Center in Portugal
To enhance the supply chain capabilities in Europe and strengthen outsourced backend manufacturing operations in the region, major automotive and power semiconductor manufacturer Infineon announced an expanded partnership with semiconductor packaging and testing services provider Amkor Techology. According to the …
[News] Chip Battle Escalates as China’s RISC-V Gains Traction, US Reportedly Examines National Security Risks
The US-China tech conflict has extended to RISC-V chips. Reuters reported on April 24th that the US Department of Commerce, in a letter dated around April 15th to members of Congress, highlighted concerns regarding China’s involvement in open-source RISC-V chip …
[News] TSMC Unveils 1.6nm Tech for the First Time, Production Set for 2026
TSMC today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 1.6nm, CoWoS, Silicon Photonics, TSMC
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[News] HBM Boosts SK Hynix’s Q1 Revenue to Record High, 734% Jump in Operating Profit QoQ
SK hynix announced today that it recorded 12.43 trillion won in revenues, 2.886 trillion won in operating profit (with an operating margin of 23%), and 1.917 trillion won in net profit (with a net margin of 15%) in the first …
[News] Apple Rumored to Develop In-House AI Processor for Mass Production in the Second Half of 2025
According to reports from global media outlets like MacRumors and Wccftech on April 23rd, Apple is said to be developing its first in-house AI processor for PCs, the M4 chip, and is also working on a self-developed AI server processor using TSMC’s …
Posted in Consumer Electronics, Notebook Computers
Tagged AI PC, Apple, Foxconn, TSMC
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