-
Recent Posts
- [News] SoftBank to Launch World’s First Supercomputer Powered by NVIDIA Blackwell Chips
- [News] OPEC Revises Down Global Oil Demand for This Year and Next Again
- [Insights] Memory Spot Price Update: DRAM Prices Fall across the Board with DDR4 Suffering Larger Drops
- [News] AMD Confirms Cutting 4% of Global Workforce
- [News] European Chipmaker CEOs Warn of Nationalist Policy Risks
Recent Comments
Archives
- November 2024
- October 2024
- September 2024
- August 2024
- July 2024
- June 2024
- May 2024
- April 2024
- March 2024
- February 2024
- January 2024
- December 2023
- November 2023
- October 2023
- September 2023
- August 2023
- July 2023
- June 2023
- May 2023
- April 2023
- March 2023
- February 2023
- January 2023
- December 2022
- November 2022
- October 2022
- September 2022
- August 2022
- July 2022
- June 2022
- May 2022
- April 2022
- March 2022
- February 2022
- January 2022
- December 2021
- November 2021
- October 2021
- September 2021
- August 2021
- July 2021
- June 2021
- May 2021
- April 2021
- March 2021
- February 2021
- January 2021
Categories
- 5G Technologies
- AR / VR
- Artificial Intelligence
- Automotive Technologies
- Broadband & Home Network
- Cloud / Edge Computing
- Consumer Electronics
- Display
- Display Supply Chain
- Display Technologies
- DRAM
- Emerging Technologies
- Energy
- IC Design
- IC Manufacturing, Package&Test
- Industry 4.0
- IoT
- IR LED / VCSEL / LiDAR Laser
- LCD
- LED
- LED Backlight
- LED Demand / Supply Data Base
- LED Display
- LED Lighting
- Lithium Battery and Energy Storage
- Macroeconomics
- Micro LED / Mini LED
- Monitors / AIO
- NAND Flash
- Notebook Computers
- OLED
- Others
- Panel Industry
- Semiconductors
- server
- Smartphones
- Solar PV
- Tablets
- Telecommunications
- TVs
- Upstream Components
- Wafer Foundries
- Wearable Devices
- 未分類
Meta
Monthly Archives: April 2024
[News] Aiming at AI Opportunities SK Hynix to Build New Plant for HBM Capacity Expansion
SK Hynix announced on April 24th that it plans to expand production capacity of the next-generation DRAM including HBM, a core component of the AI infrastructure, in response to the rapidly increasing demand for AI semiconductors. As the board of …
[News] Abandoning In-House Technology, Samsung’s XR Devices Rumored to Adopt Sony OLEDoS
Samsung Display (SDC), a subsidiary of Samsung, has been developing its own OLEDoS (OLED on Silicon) technology. However, there are reports now indicating that Samsung’s smartphone division plans to adopt Sony’s OLEDoS technology for integration into Samsung’s XR devices. According …
Posted in Consumer Electronics, Display, Wearable Devices
Tagged OLEDoS, Samsung, Sony
Leave a comment
[Insights] Spot Market Update: Shrinking Transaction Volume of DRAM; Negotiation Space Emerges in NAND Flash
According to the latest memory spot price trends released by TrendForce, overall DRAM spot market demand has not further heated up, and transaction volume has further shrunk. NAND Flash, affected by pessimistic demand, is experiencing a lack of enthusiasm in …
[News] China Reportedly Acquires Nvidia AI Chips Indirectly; Nvidia, Gigabyte Emphasize Compliance with U.S. Regulations
According to a Reuters, despite the U.S. expanding export controls on advanced artificial intelligence (AI) chips to China last year, Chinese universities and research institutions have recently acquired high-end AI chips from Nvidia through distributors. Reviewing hundreds of bidding documents, …
Posted in Artificial Intelligence, Emerging Technologies, IC Design, Semiconductors, server
Tagged Nvidia, Supermicro
Leave a comment
[News] Amid Foundry Overcapacity, Competition for HBM Intensifies Rapidly
As AI semiconductor competition intensifies, the wafer foundry industry faces new challenges due to stagnant demand and excess capacity. The battle for dominance in the high-bandwidth memory (HBM) market is also escalating. According to Business Korea, Samsung has extended the …