Monthly Archives: May 2024

[COMPUTEX 2024] VR and AR Devices Undergo Further Transformation to Shape a New Vision for Virtual-Real Integration

Posted on 2024-05-22 by TrendForce

Just as generative AI is revolutionizing industries worldwide today by creating new opportunities, the concept of the Metaverse in 2021 was similarly embraced by technology giants as a strategic goal and vision for the future of the entire tech sector. …

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[News] Google to Add EUR 1 Billion for AI Business in Reaction to CSPs’ Strong Demands

Posted on 2024-05-22 by TrendForce

On May 20, a report by Reuters revealed that Google plans to invest an additional Euro 1 billion in its data center park in Finland. This move aims to expand the scale and boost its AI business growth in Europe. …

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[News] Samsung Leadership Change, Young Hyun Jun to Head Device Solutions Division

Posted on 2024-05-21 by TrendForce

On May 21st, Samsung Electronics announced that Young Hyun Jun will take over as the head of the Device Solutions (DS) division, replacing the current leader, Kyung Kye-Hyun, who will now lead the Samsung Advanced Institute of Technology (SAIT) and …

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[News] HBM Boom May Lead to DRAM Shortages in the Second Half of the Year

Posted on 2024-05-21 by TrendForce

Memory giants Samsung, SK Hynix, and Micron are all actively investing in high-bandwidth memory (HBM) production. Industry sources cited in a report from Commercial Times indicate that due to capacity crowding effects, DRAM products may face shortages in the second …

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[News] Samsung Reportedly Doing Its Utmost to Win 3nm GPU Orders from NVIDIA

Posted on 2024-05-21 by TrendForce

According to reports from Korean news outlet FN News and Wccftech, aiming to win back NVDIA as a major customer, Samsung has made it a priority to secure chip order from the GPU heavyweight this year. To achieve this, Samsung …

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Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , , | Leave a comment