-
Recent Posts
- [News] China Reportedly Overtakes South Korea in Semiconductor Tech, Dominating Even Memory Sector
- [News] Samsung Display Partners with Intel to Target Next-Gen AI PC Market
- [News] Samsung Rumored to Adopt Hybrid Bonding Patent from China’s YMTC for 400+ Layer NAND
- [News] OLEDWorks and JDI Announce Plans to Bring World-Leading Advanced Display Manufacturing to the United States
- [News] SK hynix Set to Finalize Intel’s NAND Acquisition in March, Boosting eSSD Market Position
Recent Comments
Archives
- February 2025
- January 2025
- December 2024
- November 2024
- October 2024
- September 2024
- August 2024
- July 2024
- June 2024
- May 2024
- April 2024
- March 2024
- February 2024
- January 2024
- December 2023
- November 2023
- October 2023
- September 2023
- August 2023
- July 2023
- June 2023
- May 2023
- April 2023
- March 2023
- February 2023
- January 2023
- December 2022
- November 2022
- October 2022
- September 2022
- August 2022
- July 2022
- June 2022
- May 2022
- April 2022
- March 2022
- February 2022
- January 2022
- December 2021
- November 2021
- October 2021
- September 2021
- August 2021
- July 2021
- June 2021
- May 2021
- April 2021
- March 2021
- February 2021
- January 2021
- December 2020
- November 2020
- October 2020
- September 2020
- August 2020
- July 2020
- June 2020
- May 2020
- April 2020
- March 2020
- February 2020
- January 2020
- December 2019
- October 2019
- September 2019
- August 2019
- July 2019
- June 2019
- May 2019
- April 2019
- February 2019
- January 2019
- December 2018
- November 2018
- October 2018
- September 2018
- July 2018
- June 2018
- May 2018
- April 2018
- March 2018
- January 2018
- December 2017
- November 2017
- October 2017
- September 2017
- July 2017
- June 2017
- May 2017
- April 2017
- March 2017
- February 2017
- January 2017
- December 2016
- November 2016
- October 2016
- September 2016
- August 2016
- July 2016
- June 2016
- May 2016
- April 2016
- March 2016
- February 2016
- December 2015
- November 2015
- October 2015
- September 2015
- August 2015
- July 2015
- June 2015
- May 2015
- April 2015
- March 2015
- January 2015
- December 2014
- November 2014
- October 2014
- September 2014
- August 2014
- July 2014
- June 2014
- May 2014
- April 2014
- February 2014
- January 2014
- December 2013
- November 2013
- October 2013
- September 2013
- August 2013
- July 2013
- June 2013
- May 2013
- April 2013
- March 2013
- February 2013
- January 2013
- December 2012
- November 2012
- October 2012
- September 2012
- August 2012
- July 2012
- May 2012
- April 2012
- March 2012
- January 2012
- December 2011
- November 2011
- October 2011
- September 2011
- August 2011
- July 2011
- June 2011
- May 2011
- April 2011
- March 2011
- February 2011
- January 2011
- December 2010
- November 2010
- October 2010
- September 2010
- August 2010
- July 2010
- June 2010
- May 2010
- April 2010
- March 2010
- February 2010
- January 2010
- December 2009
- November 2009
- October 2009
- September 2009
- August 2009
- July 2009
- May 2009
- April 2009
- March 2009
- November 2008
- October 2008
- September 2008
- August 2008
- March 2008
- January 2008
- December 2007
Categories
- 5G Technologies
- AR / VR
- Artificial Intelligence
- Automotive Technologies
- Broadband & Home Network
- Cloud / Edge Computing
- Consumer Electronics
- DataTrack-EN
- DataTrack-TW
- Display
- Display Supply Chain
- Display Technologies
- DRAM
- Emerging Technologies
- Energy
- Event Report
- IC Design
- IC Manufacturing, Package&Test
- Industry 4.0
- IoT
- IR LED / VCSEL / LiDAR Laser
- LCD
- LED Backlight
- LED Chip & Package
- LED Demand / Supply Data Base
- LED Display
- LED Lighting
- Lithium Battery and Energy Storage
- Macroeconomics
- Market Today
- Market Trends
- Micro LED / Mini LED
- Monitors / AIO
- NAND Flash
- Notebook Computers
- OLED
- Optical Semiconductors
- Others
- Panel Industry
- Products News
- Research & Intelligence
- Semiconductors
- server
- Smartphones
- Solar PV
- Tablets
- Telecommunications
- TVs
- Upstream Components
- Wafer Foundries
- Wearable Devices
- 市場日報
- 未分類
- 趨勢洞察
Meta
Monthly Archives: May 2024
[News] SK Hynix Accelerates HBM4E Development, Aiming for Mass Production by 2026
SK Hynix has updated its latest timeline regarding HBM4E, the company’s 7th generation high bandwidth memory, on Monday. According to reports from Wccftech and TheElec, the memory heavyweight’s generation changes of two-year gap has been shortened to one, and is …
Posted in DRAM, Semiconductors
Leave a comment
[Insights] Trendforce: Foundry Capacity Market Share of Advanced Process to Decline in Taiwan, Korea until 2027, While US on the Rise
TrendForce’s latest findings revealed that as of 2024, Taiwan is expected to lead the global semiconductor foundry capacity in advanced manufacturing processes (including 16/14nm and more advanced technologies) with a 66% market share, followed by Korea (11%), US (10%), and …
[News] Arm to Develop AI Chip Next Spring and Start Mass Production in Autumn 2025
SoftBank Group’s global IP leader, Arm, has reportedly announced the establishment of an AI chip division with the goal of developing AI chip prototypes by spring 2025. According to a report from DRAMeXchange, mass production will be handled by contract …
[News] Apple’s Foldable Devices Reportedly to Debut with iPad, Placing Orders on Samsung
Industry sources cited by a report from Economic Daily News have indicated that Apple is accelerating the development of its foldable device, moving up the expected launch from 2026 to 2025. Apple has reportedly placed orders for flexible panels from …
Posted in Consumer Electronics, Smartphones
Tagged Apple, foldable smartphone, Huawei, Samsung
Leave a comment
[News] Samsung Reportedly to Challenge Apple/TSMC with 3nm Exynos W1000
According to a report from Korean media The Korea Economic Daily, Samsung Electronics Co. is planning to apply its 3nm process chips to its Galaxy series smartphones and smartwatches, posing a challenge to rivals Apple and TSMC. The report cited …
Posted in Consumer Electronics, Semiconductors, Smartphones, Wearable Devices
Tagged MediaTek, N3E, Qualcomm, Samsung, TSMC
Leave a comment