Monthly Archives: May 2024

[News] A Price War in SiC Wafer Sector seems to Start

Recently, rumors surfaced that price drops in the silicon carbide (SiC) wafer market. So, what is the actual market situation for SiC wafer? Currently, most companies in the supply chain agree on the fact that the price of SiC wafer …

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[News] Google to Invest USD 2 Billion in Malaysia, Focusing on Data Centers and AI

According to a report from Wall Street Journal, Alphabet CFO Ruth Porat announced in a statement on May 30 that Google has committed to investing USD 2 billion in Malaysia. The investment includes building its first data center, expanding Google …

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[News] Intel’s 1nm-class Fabs in Germany Reportedly Delayed Due to Black Soil Concerns and Pending EU Subsidy Approval

Intel has reportedly delayed its construction of Fab 29.1 and 29.2 in Magdeburg, Germany, as the new timeline now pushes the start of construction to May 2025, according to a report by tom’s Hardware, citing German media outlet Volksstimme. However, …

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[News] MediaTek Announces 4nm Dimensity 7300 Series Chips, Supporting Foldable Devices

On May 30, MediaTek unveiled the Dimensity 7300 series mobile chips, including the Dimensity 7300 and Dimensity 7300X, both utilizing TSMC’s highly efficient 4nm process. The Dimensity 7300 offers exceptional energy efficiency and performance, meeting the high demands for multitasking, …

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[News] New Regulations Reportedly Introduced by Japan Regarding Semiconductor Exports

According to a report from Nikkei News, Japan will require companies in critical industries such as semiconductor and machine tools to take measures to prevent cross-border technology leaks in order to receive government assistance. The planned technology transfer rules will …

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