Monthly Archives: May 2024

[News] Samsung Tapes out Its First High-end Mobile SoC Using 3nm Process Technology with GAA Architecture

Samsung Electronics and Synopsys jointly announced that the former has successfully taped out its first mobile system-on-chip (SoC) with its 3nm gate-all-around (GAA) process. According to Synopsys, Samsung used the Synopsys.ai EDA suite to help with the SoC’s layouts as …

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[News] More Complex than Intel’s? TSMC’s Super PowerRail – Elevating Chip Performance through Advanced Power Delivery

At TSMC’s North America Technology Symposium, per a report from TechNews, the semiconductor giant unveiled its A16 process, designed to accommodate more transistors, enhance computational performance, and reduce power consumption. Of particular interest is the integration of the Super PowerRail …

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[News] SK Hynix Reportedly Raises Prices Again, with DRAM Products to Increase by 15-20%

The surge in memory product prices continues, driven by the AI wave revitalizing the memory market. According to a report from Liberty Times Net, prices of high-performance DRAM are also on the rise. Industry sources cited by the same report …

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[News] Apple M4 Incoming, Boosting TSMC’s 3nm Production

In a bid to seize the AI PC market opportunity, Apple is set to debut its new iPad Pro on the 7th, featuring its in-house M4 chip. With the momentum of the M4 chip’s strong debut, Apple reportedly plans to …

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[News] TSMC’s Advanced Packaging Capacity Fully Booked by NVIDIA and AMD Through Next Year

With the flourishing of AI applications, two major AI giants, NVIDIA and AMD, are fully committed to the high-performance computing (HPC) market. It’s reported by the Economic Daily News that they have secured TSMC’s advanced packaging capacity for CoWoS and …

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