Monthly Archives: May 2024

[News] Export Crisis Averted, TSMC’s Nanjing Plant Reportedly Granted Indefinite Exemption

Posted on 2024-05-24 by TrendForce

TSMC’s Nanjing plant has averted an export permit expiration crisis. On May 23rd, TSMC confirmed that it has recently received the “Validated End-User” (VEU) authorization from the U.S. Department of Commerce for TSMC (Nanjing) Co., Ltd., according to a report …

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[News] NVIDIA’s Packaging Advancement Boosts Taiwanese Supply Chain with Emerging Opportunities in Panel-Level Fan-Out Packaging

Posted on 2024-05-24 by TrendForce

To alleviate the capacity constraints of CoWoS advanced packaging, NVIDIA is reportedly planning to accelerate the introduction of its GB200, into panel-level fan-out packaging. According to a report from Economic Daily News, originally scheduled for 2026, this shift has been …

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[News] Reasons for Samsung’s HBM Chips Failing Nvidia Tests Revealed, Reportedly Due to Heat and Power Consumption Issues

Posted on 2024-05-24 by TrendForce

Samsung’s latest high bandwidth memory (HBM) chips have reportedly failed Nvidia’s tests, while the reasons were revealed for the first time. According to the latest report by Reuters, the failure was said to be due to issues with heat and …

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[News] SK Hynix Revealed Progress for HBM3e, Achieving Nearly 80% Yield

Posted on 2024-05-24 by TrendForce

SK hynix has disclosed yield details regarding the company’s 5th generation High Bandwidth Memory (HBM), HBM3e, for the first time. According to a report from the Financial Times, citing Kwon Jae-soon, the head of yield at SK hynix, the memory …

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[News] TSMC Says Tripling 3nm Capacity This Year Still Not Enough

Posted on 2024-05-23 by TrendForce

According to a report from TechNews, TSMC held a technology forum on May 23, where Senior Fab Director pointed out that benefiting from HPC and mobile phone demands, the 3nm production capacity this year has more than tripled compared to …

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