-
Recent Posts
- [News] Tokyo Electron Cautions on Slowing Demand from China Despite Upgrading FY 2025 Forecast
- [News] Supermicro Reaffirms Unchanged Expansion Plans for Malaysia Plant, Cites Strong Order Demand
- [News] AI is Booming, Creating Opportunities for SiC and GaN
- [News] Samsung to Expand HBM Packaging Facilities South of Seoul, Targeting Completion by 2027
- [News] Consumers Still Struggle with High Prices Despite Inflation Returning to Pre-Pandemic Levels.
Recent Comments
Archives
- November 2024
- October 2024
- September 2024
- August 2024
- July 2024
- June 2024
- May 2024
- April 2024
- March 2024
- February 2024
- January 2024
- December 2023
- November 2023
- October 2023
- September 2023
- August 2023
- July 2023
- June 2023
- May 2023
- April 2023
- March 2023
- February 2023
- January 2023
- December 2022
- November 2022
- October 2022
- September 2022
- August 2022
- July 2022
- June 2022
- May 2022
- April 2022
- March 2022
- February 2022
- January 2022
- December 2021
- November 2021
- October 2021
- September 2021
- August 2021
- July 2021
- June 2021
- May 2021
- April 2021
- March 2021
- February 2021
- January 2021
Categories
- 5G Technologies
- AR / VR
- Artificial Intelligence
- Automotive Technologies
- Broadband & Home Network
- Cloud / Edge Computing
- Consumer Electronics
- Display
- Display Supply Chain
- Display Technologies
- DRAM
- Emerging Technologies
- Energy
- IC Design
- IC Manufacturing, Package&Test
- Industry 4.0
- IoT
- IR LED / VCSEL / LiDAR Laser
- LCD
- LED
- LED Backlight
- LED Demand / Supply Data Base
- LED Display
- LED Lighting
- Lithium Battery and Energy Storage
- Macroeconomics
- Micro LED / Mini LED
- Monitors / AIO
- NAND Flash
- Notebook Computers
- OLED
- Others
- Panel Industry
- Semiconductors
- server
- Smartphones
- Solar PV
- Tablets
- Telecommunications
- TVs
- Upstream Components
- Wafer Foundries
- Wearable Devices
- 未分類
Meta
Monthly Archives: June 2024
[News] TSMC Reportedly Invests over USD 12.3 Billion in EUV, Advancing in 2nm Production
TSMC’s advanced 2-nanometer process capacity is set to begin mass production in 2025, with equipment manufacturers actively delivering machines. According to a report from Commercial Times, the EUV (Extreme Ultraviolet Lithography) machines, crucial for advanced processes, will see over 60 …
[News] Samsung Rumored to Adopt MediaTek’s Dimensity 9400 in Galaxy S25
According to a report from South Korean media outlet The Financial News, MediaTek, Taiwan’s largest smartphone IC designer, has the opportunity to enter Samsung’s Galaxy S25 supply chain as one of the main chip suppliers for the next generation flagship …
Posted in Consumer Electronics, Semiconductors, Smartphones
Tagged Dimensity 9400, MediaTek, Qualcomm, Samsung, Snapdragon
Leave a comment
[News] Japanese Equipment Giant TEL Emerges as Major Winner as EUV Orders Surge
According to a report from the Commercial Times, Tokyo Electron (TEL), a leading global semiconductor equipment manufacturer, is the only company in the world that possesses equipment for four consecutive processes: deposition, coating/developing, etching, and cleaning, which are crucial steps before …
[News] Huawei Faces Production Challenges with 20% Yield Rate for AI Chip
Previously, Huawei claimed its second-generation AI chip “Ascend 910B” could compete with NVIDIA’s A100 and was working to replace NVIDIA, which holds over 90% of the market share in China. However, Huawei is now facing significant obstacles in expanding its …
[News] Entegris Receives Subsidy, Hinting at a Shift in U.S. Chip Funding Strategy?
In recent years, global semiconductor market has seen cut-throat competition. Amid complicated international environment, countries and regions such as South Korea, the United States, Japan, and Europe have launched chip subsidy measures to strengthen the development of their domestic semiconductor …