Monthly Archives: June 2024

[News] WD and FADU to Co-Develop Enterprise SSD Technology

Recently, Korean SSD controller manufacturer FADU announced a partnership with Western Digital to co-develop the next-generation enterprise SSD technology called “FDP (Flexible Data Placement).” FDP is a standard technology proposed by the Open Compute Project (OCP) and is a newly …

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[News] Venturing into AI, Innolux Reportedly Partners with Memory Giants, While Its 4th Plant in Tainan to Focus on Packaging Applications

Taiwanese panel company Innolux have said to be involving in collaborating with leading global memory manufacturers. According to a report from the Economic Daily News, plans are underway to repurpose its 4th Plant in Tainan (5.5-generation LCD panel plant) for AI-related semiconductor applications, …

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[News] With Memory Market Recovering, Kioxia Has Reportedly Ceased Production Cuts and Secured Bank Lending

According to a report from Nikkei, Japanese memory manufacturer Kioxia has ended production cuts amidst a recovery in the memory market and has secured new bank credit support. The company’s plants in Yokkaichi, Mie Prefecture, and Kitakami, Iwate Prefecture, have …

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[News] Samsung Adopts Dimensity 9300+ Instead of Snapdragon, the First Time for Its Flagship Tablet to Feature MediaTek AP

According to a report by the Korean media outlet The Chosun Daily on June 16th, Samsung’s “Galaxy Tab S10” series tablets will be equipped with MediaTek’s Dimensity 9300+ application processor (AP) from Taiwan, marking the first instance of MediaTek’s AP …

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[News] Samsung Plans to Introduce 3D HBM Chip Packaging Service in 2024

In 2023, Samsung disclosed plans to launch its advanced three-dimensional (3D) chip packaging technology, which would be able to integrate memory and processors needed for high-performance chips, in much smaller sizes. Now, at the Samsung Foundry Forum in San Jose …

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