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Monthly Archives: June 2024
[News] US Reportedly Mulls to Further Limit China’s Access to GAA Chip Technology and HBM
Starting from October, 2022, the U.S. has launched a series of export controls, targeting to limit China’s access to advanced semiconductor technologies, while tech giants including Intel, Qualcomm and NVIDIA are not allowed to ship some of their most cutting-edge …
Posted in DRAM, IC Manufacturing, Package&Test, Semiconductors
Tagged GAA, GAAFET, HBM, Intel, Samsung, TSMC
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[News] DDR3 Price Rebound Expected in the Upcoming Quarters, Benefiting Taiwanese Manufacturers
As the standard DRAM market experiences an unprecedented cycle of supply-demand imbalance, the shortage of DDR3 production capacity has become even more severe. According to a report from the Economic Daily News, with leading manufacturers like Samsung exiting DDR3 production, while …
[News] Samsung Considers Hybrid Bonding a Must for 16-stack HBM
According to the latest report by TheElec, though Samsung has been using thermal compression (TC) bonding until its 12-stack HBM, the company now confirms its belief that hybrid bonding is necessary for manufacturing 16-stack HBM. Regarding its future HBM roadmap, …
[News] Huawei’s Self-developed AI Chip Challenges NVIDIA, Boasting Its Ascend 910B to Be Equal in Match With A100
According to a report from South China Morning Post, Wang Tao, Executive Director, Chairman of the ICT Infrastructure Managing Board at Huawei, recently stated at the World Semiconductor Conference and Nanjing International Semiconductor Expo that Huawei’s advanced Ascend 910B AI …
[News] Huawei Reportedly Acknowledges China’s Semiconductor Development May Have Plateaued, Facing Challenges Below 3.5nm
The ongoing tightening of US restrictions on China’s access to advanced chips and production equipment may have significant impact on China’s semiconductor development progress. According to a report from Liberty Times, a top executive at Huawei, a Chinese tech giant, …