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Monthly Archives: June 2024
[News] Samsung Reportedly Seeks USD 3.6 Billion Loan from State-Run Bank for Chip Investment
According to a report from Korean media outlet Korea Economic Daily (KED), South Korean tech giant Samsung Electronics is looking to borrow up to KRW 5 trillion (approximately USD 3.6 billion) from the state-run Korea Development Bank (KDB) to finance …
[News] Foxconn’s Young Liu Newly Elected as Sharp’s Chairman to Assist Transformation
Foxconn Chairman Young Liu has been elected as Sharp’s chairman at Sharp’s shareholders’ meeting on 27th, according to a report from the Economic Daily News, citing an announcement by the Tokyo Stock Exchange. The report also noted that Liu will …
[News] NAND Flash Giant Kioxia Reportedly Plans IPO by Late October amid Market Recovery
According to a Reuters report on June 26th citing sources, with semiconductor market conditions rebounding and financial performance rapidly improving, NAND flash leader Kioxia is reportedly gearing up to file a preliminary application soon and aims to debut on the Tokyo Stock …
[News] Samsung Reportedly to Raise Memory Price by 15-20% in Q3, Boosting Second Half Performance
According to a report from South Korean media Maeil Business Newspaper, Samsung Electronics plans to raise prices for server DRAM and enterprise NAND flash by 15% to 20% in the third quarter due to surging demand for artificial intelligence (AI). …
[News] Samsung Refutes Rumors Regarding 3nm Wafer Defects as Groundless
Rumors have been circulating regarding Samsung’s 3nm yield recently. The latest market speculation on June 25th alleged that Samsung’s foundry plant encountered a defect impacting 2,500 lots in the 3nm second-generation process, reportedly leading to a loss of 1 trillion …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 3nm, Exynos 2500, Qualcomm, Samsung, Snapdragon
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