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Monthly Archives: June 2024
[News] Qualcomm CEO Reportedly Considers Collaboration with Samsung to Diversify Smartphone Chip Foundry Sources
Qualcomm President & CEO Cristiano Amon, at COMPUTEX 2024, showcased devices powered by Snapdragon X Elite and Snapdragon X Plus processors, claiming them to be the only PCs capable of delivering Copilot+ PC experiences. Afterwards, during a media briefing, he …
Posted in IC Design, IC Manufacturing, Package&Test, Semiconductors
Tagged Qualcomm, Samsung, TSMC
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[News] New Standard for DDR6 Memory to Come out Soon
JEDEC (the Solid State Technology Association) recently confirmed that the long-used SO-DIMM and DIMM memory standards will be replaced by CAMM2 for DDR6 (LPDDR6 included). According to a report from WeChat account DRAMeXchange, the minimum frequency for DDR6 memory is …
[News] TSMC Affiliate VIS and NXP to Invest USD 7.8 Billion for 12-Inch Fab in Singapore, Expected Mass Production by 2027
Vanguard International Semiconductor (VIS), an affiliate of TSMC, announced today a joint venture with NXP to build a 12-inch fab in Singapore. According to its press release, the construction is set to begin in the second half of 2024, with mass …
[News] Supermicro President Charles Liang Bullish on Direct Liquid Cooling, Targeting a 15% Market Share within Next Year
Charles Liang, President and CEO of AI server giant Supermicro, delivered a keynote speech at COMPUTEX earlier today. According to a report from CNA, while expressing his optimism in expanding the company’s market share in the Direct Liquid Cooling (DLC) field, …
Posted in Semiconductors, server
Tagged COMPUTEX 2024, DLC, Nvidia, server, Supermicro, Taiwan
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[News] Jensen Huang Confirms NVIDIA Approaches Certification of Samsung’s HBM Chips
NVIDIA CEO Jensen Huang revealed that Samsung’s High Bandwidth Memory (HBM) is still striving on the certification process, but is one step away from beginning supply. According to a report from Bloomberg on June 4th, Huang, during a briefing at …