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Monthly Archives: June 2024
[Insights] Memory Spot Price Update: DRAM Remains Weak Despite Samsung’s Capacity Shift to HBM
According to TrendForce’s latest memory spot price trend report, the spot price of DRAM remains weak, as Samsung’s reallocation of its D1A process to the manufacturing of HBM products did little help. As for NAND flash, overall transactions are also sitting …
[News] China Targets Tech Leadership by 2035 in Six Areas, Including Semiconductors
According to a report from the Economic Daily News, amid the escalating US-China tech war, Chinese President Xi Jinping emphasized the need to enhance the sense of urgency and intensify efforts in technological innovation. Particularly in six key areas, including …
[News] ASMPT Reportedly Provided Demo TC Bonder to Micron for HBM Production
Driven by memory giants ramping up high-bandwidth memory (HBM) production, according to a report from Korean media outlet TheElec, ASMPT, a back-end equipment maker, has supplied a demo thermal compression (TC) bonder for Micron’s HBM production. TC bonders play a pivotal role …
Posted in DRAM, Semiconductors
Tagged HBM, HBM3e, HBM4, Micron, SK Hynix, TC bonders
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[News] TSMC Rumored to Build New CoWoS Plant in Southern Taiwan
TSMC’s advanced CoWoS packaging capacity is in severe shortage, and just as the new plant in the Chiayi Park of Southern Taiwan Science Park began construction for expansion, according to a report from Economic Daily News citing sources, it has …
[News] Memory Giants Samsung and Micron Rumored to Expand Production
Recently, it was reported that to meet the increasing demand for memory chips driven by the artificial intelligence (AI) boom, both Samsung Electronics and Micron set about ramping up their memory chip production capacity. Samsung plans to restart construction of …