Monthly Archives: June 2024

[News] TSMC’s Kumamoto Fab 2 Reportedly Begins Land Preparation

According to a report from Japanese news outlet Kyodo News, TSMC’s Fab in Kikuyo, Kumamoto Prefecture, Japan (Kumamoto Fab 1) is expected to start mass production in Q4 this year. The planned second Fab (Kumamoto Fab 2) will also be …

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[Insights] Memory Spot Price Update: DRAM Remains Weak Despite Samsung’s Capacity Shift to HBM

According to TrendForce’s latest memory spot price trend report, the spot price of DRAM remains weak, as Samsung’s reallocation of its D1A process to the manufacturing of HBM products did little help. As for NAND flash, overall transactions are also sitting …

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[News] China Targets Tech Leadership by 2035 in Six Areas, Including Semiconductors

According to a report from the Economic Daily News, amid the escalating US-China tech war, Chinese President Xi Jinping emphasized the need to enhance the sense of urgency and intensify efforts in technological innovation. Particularly in six key areas, including …

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[News] ASMPT Reportedly Provided Demo TC Bonder to Micron for HBM Production

Driven by memory giants ramping up high-bandwidth memory (HBM) production, according to a report from Korean media outlet TheElec, ASMPT, a back-end equipment maker, has supplied a demo thermal compression (TC) bonder for Micron’s HBM production. TC bonders play a pivotal role …

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[News] TSMC Rumored to Build New CoWoS Plant in Southern Taiwan

TSMC’s advanced CoWoS packaging capacity is in severe shortage, and just as the new plant in the Chiayi Park of Southern Taiwan Science Park began construction for expansion, according to a report from Economic Daily News citing sources, it has …

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