Monthly Archives: June 2024

[News] Broadcom Reportedly Developing 5nm AI Chip with ByteDance, Manufactured by TSMC

According to a report from Reuters, it’s rumored that ByteDance, the parent company of TikTok, is collaborating with American chip designer Broadcom to develop an advanced AI processor, which could provide ByteDance with a steady supply of high-end chips. On …

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[News] SK Hynix’s 5-layer 3D DRAM Yield Reportedly Hits 56.1%

According to a report by Korean media outlet Business Korea, SK Hynix recently shared its latest breakthrough on its 3D DRAM at VLSI 2024 last week, announcing that the manufacturing yield of its 5-layer stacked 3D DRAM has reached 56.1%. This means that …

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[News] Samsung’s 3nm Yield Reportedly Below 20%, Struggling for Mass Production

According to a report from Korean media outlet ZDNet Korea, the yield rate for Samsung Electronics’ latest Exynos 2500 processor has improved to slightly below 20% from single digits in the first quarter. However, the current yield rate is still said …

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[News] TSMC Reportedly Secures Another AI Opportunity, Winning Order from SK Hynix

According to a report by the Economic Daily News, TSMC has secured another AI business opportunity. Following its exclusive contract manufacturing of AI chips for tech giants such as NVIDIA and AMD, TSMC, in collaboration with its subsidiary, the ASIC …

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[News] IMEC Rolled out Functional Monolithic CFET Device to be Introduced in 0.7nm A7 Node

On June 18th, Belgium’s microelectronics research center IMEC showcased the first CMOS CFET device featuring stacked bottom and top source/drain contacts at the 2024 IEEE VLSI Technology and Circuits Symposium (2024 VLSI). Although the results were achieved using front-side lithography …

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