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Monthly Archives: June 2024
[News] SK keyfoundry Advances in GaN Power Semiconductors, Reportedly Producing for Tesla Soon
SK keyfoundry, a subsidiary of memory giant SK hynix, has achieved notable progress in the development of Gallium Nitride (GaN) power semiconductors. According to the latest report by Business Korea, the foundry would begin producing power semiconductors for Tesla in …
[News] ASE Sets Up New Facility in Kaohsiung for Advanced Packaging, Targeting Completion in 2026
According to a report from CNA, Taiwanese semiconductor testing and packaging giant ASE announced on June 21st that it will collaborate with Hung Ching Development & Construction Corporation to jointly build the K28 plant in Kaohsiung. Scheduled for completion in …
[News] Apple’s AI Push on iPhone 16 in China Faces Obstacles in Finding Local Partners
Though being capable of running AI features may be the primary focus for global smartphones this year, due to restrictions on AI products’ usage in China, the Wall Street Journal reports that the upcoming new iPhone, expected at the end of the year, …
Posted in Consumer Electronics, Smartphones
Tagged AI, Apple, China, iPhone, smartphone
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[News] Novatek’s Supply Advantage Fades, as Korean Competitor Reportedly Secures iPhone 16 Order
Novatek, a major driver IC manufacturer in Taiwan, entered the iPhone 16 supply chain early this year and secured certification ahead of its competitor LX Semi. However, according to a report from Commercial Times citing sources, its Korean competitor, LX Semi, recently also obtained …
Posted in Consumer Electronics, Display, OLED, Panel Industry
Tagged Apple, LGD, LX Semi, Novatek, OLED, TV
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[News] New Battleground for TSMC, Samsung & Intel in Panel-Level Packaging
According to a previous report from Nikkei citing sources, TSMC is rumored to be entering the fan-out panel-level packaging sector. As cited in a report from UDN, Intel and Samsung have also announced plans to invest in this area. With …
Posted in Semiconductors, Wafer Foundries
Tagged advanced packaging, Glass Substrates, Intel, Samsung, TSMC
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