-
Recent Posts
- [News] SoftBank to Launch World’s First Supercomputer Powered by NVIDIA Blackwell Chips
- [News] OPEC Revises Down Global Oil Demand for This Year and Next Again
- [Insights] Memory Spot Price Update: DRAM Prices Fall across the Board with DDR4 Suffering Larger Drops
- [News] AMD Confirms Cutting 4% of Global Workforce
- [News] European Chipmaker CEOs Warn of Nationalist Policy Risks
Recent Comments
Archives
- November 2024
- October 2024
- September 2024
- August 2024
- July 2024
- June 2024
- May 2024
- April 2024
- March 2024
- February 2024
- January 2024
- December 2023
- November 2023
- October 2023
- September 2023
- August 2023
- July 2023
- June 2023
- May 2023
- April 2023
- March 2023
- February 2023
- January 2023
- December 2022
- November 2022
- October 2022
- September 2022
- August 2022
- July 2022
- June 2022
- May 2022
- April 2022
- March 2022
- February 2022
- January 2022
- December 2021
- November 2021
- October 2021
- September 2021
- August 2021
- July 2021
- June 2021
- May 2021
- April 2021
- March 2021
- February 2021
- January 2021
Categories
- 5G Technologies
- AR / VR
- Artificial Intelligence
- Automotive Technologies
- Broadband & Home Network
- Cloud / Edge Computing
- Consumer Electronics
- Display
- Display Supply Chain
- Display Technologies
- DRAM
- Emerging Technologies
- Energy
- IC Design
- IC Manufacturing, Package&Test
- Industry 4.0
- IoT
- IR LED / VCSEL / LiDAR Laser
- LCD
- LED
- LED Backlight
- LED Demand / Supply Data Base
- LED Display
- LED Lighting
- Lithium Battery and Energy Storage
- Macroeconomics
- Micro LED / Mini LED
- Monitors / AIO
- NAND Flash
- Notebook Computers
- OLED
- Others
- Panel Industry
- Semiconductors
- server
- Smartphones
- Solar PV
- Tablets
- Telecommunications
- TVs
- Upstream Components
- Wafer Foundries
- Wearable Devices
- 未分類
Meta
Monthly Archives: June 2024
[News] China’s Xiaomi and Unisoc Claim Domestic 4nm Mobile Processors Coming Soon
As China keeps reducing its reliance on the global semiconductor supply chain with strong support from the authority, two major smartphone manufacturers reportedly claim to have already taped out their own 4nm mobile processors. According to the reports by Liberty …
[News] TSMC Reportedly Develops Panel-Level Packaging, Another New Chip Packaging Tech
According to a report from Nikkei citing sources, TSMC is developing a new advanced chip packaging technology that uses rectangular panel-like substrates, rather than the traditional circular wafers currently in use. This technology allows for more chips to be placed …
[News] Foxconn Likely Wins Order for Apple’s Rumored Cheaper Vision Pro
Apple is reportedly shifting its mixed reality (MR) device strategy by abandoning the development of its existing high-end Vision Pro headset in favor of launching an affordable MR device expected to debut next year. According to a report from Economic …
Posted in Consumer Electronics, Emerging Technologies, Wearable Devices
Tagged Apple, Foxconn, GIS, GSEO, Headset, MR
Leave a comment
[News] Micron’s HBM Expansion at Full Throttle: Rumored to Expand in US, Malaysia Also an Option
According to a report from Nikkei citing sources, memory giant Micron Technology is building a pilot production line for advanced high-bandwidth memory (HBM) in the United States and is considering producing HBM in Malaysia for the first time to capture …
[News] Intel Claims Its Datacenter-oriented 3nm Enters High-volume Production
While TSMC faces overwhelming demand for its 3nm technology, with orders from major clients like Apple and NVIDIA pouring in, Intel has now announced its progress on the 3nm technology. According to the latest report by Tom’s Hardware, Intel 3 …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 3nm, Intel, Samsung, TSMC
Leave a comment