Monthly Archives: June 2024

[News] Intel Claims Its Datacenter-oriented 3nm Enters High-volume Production

While TSMC faces overwhelming demand for its 3nm technology, with orders from major clients like Apple and NVIDIA pouring in, Intel has now announced its progress on the 3nm technology. According to the latest report by Tom’s Hardware, Intel 3 …

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[News] US to Lobby Netherlands and Japan to Contain China’s Chip Development, Focusing on HBM

According to a report from Reuters on June 19, to further restrict China’s semiconductor industry and prevent the use of semiconductor manufacturing equipment in military applications, Alan Estevez, the U.S. Commerce Department’s Under Secretary for Industry and Security, will visit the …

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[News] NATO Reportedly Credited USD 1.1 Billion to Support AI and Semiconductor Sectors

Recently, Reuters reported that NATO (North Atlantic Treaty Organization) has confirmed the first companies to receive Innovation Fund of EUR 1 billion (USD 1.1 billion). The companies are four European tech startups namely London-based AI chip manufacturer Fractile and Germany-based …

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[News] Samsung and SK hynix to Implement Hybrid Bonding with 3D DRAM

Samsung and SK hynix, which have been rapidly advancing in the High-Bandwidth Memory (HBM) arena, now confirm their intention to incorporate hybrid bonding in the upcoming 3D DRAM technology, according to the latest report by The Elec. While the current …

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[Insights] Memory Spot Price Update: High Inventory and China’s Crackdown on Smuggling Cause DRAM Spot Price to Drop

According to TrendForce’s latest memory spot price trend report, neither the spot price of DRAM nor that of NAND flash shows much sign of a turnaround in the short term. It is also worth noting that the Chinese government has …

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