Monthly Archives: June 2024

[News] US to Lobby Netherlands and Japan to Contain China’s Chip Development, Focusing on HBM

According to a report from Reuters on June 19, to further restrict China’s semiconductor industry and prevent the use of semiconductor manufacturing equipment in military applications, Alan Estevez, the U.S. Commerce Department’s Under Secretary for Industry and Security, will visit the …

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[News] NATO Reportedly Credited USD 1.1 Billion to Support AI and Semiconductor Sectors

Recently, Reuters reported that NATO (North Atlantic Treaty Organization) has confirmed the first companies to receive Innovation Fund of EUR 1 billion (USD 1.1 billion). The companies are four European tech startups namely London-based AI chip manufacturer Fractile and Germany-based …

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[News] Samsung and SK hynix to Implement Hybrid Bonding with 3D DRAM

Samsung and SK hynix, which have been rapidly advancing in the High-Bandwidth Memory (HBM) arena, now confirm their intention to incorporate hybrid bonding in the upcoming 3D DRAM technology, according to the latest report by The Elec. While the current …

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[Insights] Memory Spot Price Update: High Inventory and China’s Crackdown on Smuggling Cause DRAM Spot Price to Drop

According to TrendForce’s latest memory spot price trend report, neither the spot price of DRAM nor that of NAND flash shows much sign of a turnaround in the short term. It is also worth noting that the Chinese government has …

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[News] Semiconductor Talent War Heats up, as NVIDIA Emerges as the Biggest Winner

As tech heavyweights eagerly pursue more market share in the AI sector, the battle for talents in the semiconductor industry has also heated up. According to the latest report by The Chosun Daily, citing LinkedIn data as of June 18, …

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