Monthly Archives: July 2024

[News] China Contributes Over 40% of U.S. Chip Equipment Makers’ Revenue despite Export Controls

Though the U.S. keeps tightening the export controls on the semiconductor sector, major chip equipment makers seem to become increasingly dependent on the Chinese market. According to a report by Nikkei, citing financial data such as Applied Materials and Lam …

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[News] TSMC Reportedly Forms a Team on FOPLP Development, with Mini Line on the Road   

With the surge in new applications like AI, advanced packaging remains a hot topic, particularly with FOPLP (Fan-Out Panel Level Packaging) technology gaining renewed attention. According to sources cited by a report from MoneyDJ, leading semiconductor foundry TSMC has officially …

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[News] JEDEC Releases New HBM4 Spec as Memory Giants Gear up to Take the Lead

As top memory giants and AI chip companies all gear up for the combat of next-gen high bandwidth memory (HBM), JEDEC, the leader in the development of standards for the microelectronics industry, revealed the preliminary specifications of HBM4 last week. …

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[News] Huawei’s Largest Global R&D Center in Shanghai Unveiled, Invests Over USD 1.4 Billion

To overcome the restrictions from the US and its allies, China is said to be heavily investing in semiconductor development. According to a report from Liberty Times Net, Huawei has completed its “Lianqiu Lake R&D Center” with a total investment …

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[News] TSMC Reportedly Sees Strong 4nm Demand, with NVIDIA’s Order Up by 25%

According to the industry sources cited in a report from Economic Daily News, TSMC is gearing up to start production of NVIDIA’s latest Blackwell platform architecture graphics processors (GPU) on the 4nm process. In response to the strong customer demand, NVIDIA …

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