Monthly Archives: July 2024

[News] Global Chip Equipment Sales in 2024 Expected to Hit Record High, Even Higher Next Year

Posted on 2024-07-11 by TrendForce

This year, global semiconductor manufacturing equipment sales are expected to grow and set a new historical record. It is estimated that next year will see even more robust growth, with an anticipated increase of 17%. According to the forecast report …

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[News] Foxconn Ventures into Advanced Packaging, Sharp to Follow with Production Capacity in 2026

Posted on 2024-07-11 by TrendForce

According to a report from Economic Daily News, Foxconn Group is advancing into the field of advanced packaging with a strategic alliance between Taiwan and Japan, focusing on the trending panel-level fan-out packaging (FOPLP). Following Innolux’s related developments in Taiwan, …

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[News] A Closer Look at the Eight Japanese Firms’ JPY 5 Trillion Semiconductor Investment Plans

Posted on 2024-07-11 by TrendForce

To revitalize its domestic semiconductor chip industry, Japan has launched several measures in recent years, including financial subsidies. According to Japanese media reports, many Japanese companies will invest JPY 5 trillion (Around USD 30.96 billion) to develop the semiconductor business. …

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[News] China’s Moore Threads Develops MTLink to Challenge NVIDIA’s NVLink

Posted on 2024-07-11 by TrendForce

According to a report from Tom’s Hardware, it’s reported that one of GPU giant NVIDIA’s key advantages in data centers is not only its leading GPUs for AI and HPC computing but also its effective scaling of data center processors using …

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[News] Glass Substrate Mass Production is Nearing, with Tech Giants Leading the Way

Posted on 2024-07-10 by ChloeWang

Recently, Intel, AMD, Samsung, LG Innotek, and SKC’s US subsidiary Absolics have all highly focused on glass substrate technology for advanced packaging. Due to its excellent performance, glass substrate technology has become a rising star in the field of advanced …

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