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- [News] NVIDIA Supplier Advantest: AI Phones May Sustain Chip Industry amid Declining Data Center Investment
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Monthly Archives: July 2024
[News] China Lists Semiconductor Self-Reliance Challenges, Excluding Lithography Equipment
The China Association for Science and Technology (CAST) recently listed challenges facing China’s semiconductor industry. However, the list did not include lithography. According to a report from TechNews, it’s believed that the move to exclude lithography is more of a political consideration …
[News] Japan Chipmakers, Led by Sony and Mitsubishi, Plan to Invest JPY 5 Trillion in Semiconductors
To capitalize on the expanding opportunities in artificial intelligence (AI), electric vehicles (EV), and the carbon reduction market, eight Japanese companies, including Sony and Mitsubishi Electric, plan to invest JPY 5 trillion (around USD 30 billion) in semiconductors. According to …
Posted in Semiconductors
Tagged Fuji Electric, Japan, Kioxia, Mitsubishi Electric, Rapidus, Renesas, ROHM, semiconductor, Sony, Toshiba
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[News] Xiaomi’s Smart Factory Opens with 10 Million Annual Flagship Smartphone Capacity
On July 8, Xiaomi Chairman Lei Jun announced on Weibo that the new generation Xiaomi smartphone smart factory in Changping, Beijing, has officially started operations. According to a report from Economic Daily News, the factory has a total investment of …
[News] Semiconductor Equipment Sales Soared in Chinese and Japanese Markets
While driving advances in HBM, foundry, and advanced packaging, AI generative applications also boosted the demand and sales of semiconductor equipment. Recently, Japanese semiconductor equipment giant DISCO announced that its non-consolidated (individual) shipments for April to June 2024 amounted to …
Posted in Semiconductors
Tagged Advantest, China, DISCO, HBM, Hitachi, Japan, Nikon, TEL
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[News] Hanmi Semiconductor to Launch 2.5D TC Bonders, Eyeing Strong Growth in 2024-26
As the demand for AI chips surges, orders for thermal compression (TC) bonders, which play a critical role in HBM (high-bandwidth memory) manufacturing, are also heating up. To further gain market momentum, South Korean chip packaging equipment manufacturer Hanmi Semiconductor …
Posted in DRAM, NAND Flash, Semiconductors
Tagged HBM, Micron, Samsung, SKHynix, TC bonders, thermal compression
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