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Recent Posts
- [News] Qualcomm’s Snapdragon 8 Elite 2 to Use TSMC’s N3P as Samsung Reportedly Lost Order
- [News] NVIDIA Supplier Advantest: AI Phones May Sustain Chip Industry amid Declining Data Center Investment
- [News] TSMC Sets Key Milestone in Japan as Kumamoto Fab Begins Mass Production
- [News] Xiaomi to Scale AI Capabilities with New 10,000-GPU Cluster Investment
- [News] Why Are AR Glasses Reportedly Outselling Apple’s Vision Pro in China, with 284K Units Sold in 2024?
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Monthly Archives: July 2024
[News] Huawei Reportedly to Launch Kirin 9100 with Superior Performance to Snapdragon 8 Gen 2
According to a report from Wccftech, Huawei’s Kirin 9100 processor is scheduled to be unveiled later this year, rumored to be manufactured using SMIC’s 5nm process. Its performance is reported to surpass that of the Qualcomm Snapdragon 8 Gen 2, and …
Posted in Consumer Electronics, Semiconductors, Smartphones
Tagged DUV, Huawei, Kirin 9100, SMIC, Snapdragon
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[News] ASML Former CEO Predicts Chip War Between China and the US May Persist for Decades
Peter Wennink, former CEO of ASML, recently stated in an interview with Dutch broadcaster BNR that the chip war between China and the US lacks factual basis and is entirely driven by ideology. According to reports from Reuters and the …
Posted in Semiconductors
Tagged ASML, China, EUV, export restriction, Netherland, US
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[News] Booming GPU and HBM Demand Pushes Japanese Chip Equipment Annual Sales to Record High
With the widespread adoption of AI, the demand for GPUs and high-bandwidth memory (HBM) is soaring. The Semiconductor Equipment Association of Japan (SEAJ) has revised its forecast for sales of Japanese-made semiconductor equipment, predicting that for the first time in history, …
[News] TSMC Reportedly Gains Another 3nm Order for Q4 Flagship Smartphone Chips
MediaTek and Qualcomm’s new wave of 5G flagship smartphone chip competition will begin in the fourth quarter. MediaTek is launching the “Dimensity 9400” to directly compete with Qualcomm’s “Snapdragon 8 Gen 4.” According to a report from Economic Daily News, …
Posted in Consumer Electronics, Semiconductors, Smartphones
Tagged 3nm, Dimensity 9400, MediaTek, Qualcomm, Snapdragon, TSMC
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[News] Korean Advanced Packaging Industry’s Rise Delayed by TSMC and ASE Expansion
South Korean media reports that the main suppliers of artificial intelligence (AI) chip packaging are concentrated in TSMC and ASE Technology Holding Co., which have been actively expanding production to meet the growing market demand. Despite efforts to develop technology …