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Recent Posts
- [News] Samsung Suffers Another Setback as Galaxy S25 Reportedly Features Micron’s LPDDR5 over Its Own
- [News] Samsung Electronics Anticipates Mounting Challenges Amid Faltering Chip Business
- [News] MediaTek’s Dimensity 9500 Might Use TSMC’s N3P instead of 2nm, Giving Samsung an Advantage
- [News] China Adds 28 U.S. Entities to Export Control List before Trump Takes Office, with Epi-wafer Giant Included
- [News] SK hynix to Showcase 16-layer HBM3E Samples at CES 2025, along with eSSD, CXL Developments
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Monthly Archives: July 2024
[News] Samsung’s HBM3e Reportedly Passed NVIDIA’s Certification Though It Denies the Rumor
In early June, NVIDIA CEO Jensen Huang revealed that Samsung’s High Bandwidth Memory (HBM) is still striving on the certification process, but is one step away from beginning supply. On July 4th, a report from Korea media outlet Newdaily indicated …
[News] MediaTek and Xiaomi Opened a Joint Lab, the First Product with Stellar Performance Unveiled
MediaTek and Xiaomi Group have deepened their collaboration. On July 2, Xiaomi China’s Vice President of Marketing and General Manager of the Redmi brand, Wang Teng, announced on Weibo that the joint laboratory between Xiaomi and MediaTek has officially opened …
Posted in Consumer Electronics, Semiconductors, Smartphones
Tagged Dimensity 9300, MediaTek, Xiaomi
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[News] China Plans to Set at Least 50 AI Standards by 2026, from Language Models to Semiconductors
China aims to establish at least 50 AI standards by 2026, as outlined in a new draft policy from Beijing, according to a report by South China Morning Post. The draft policy, released on Tuesday by the Ministry of Industry …
Posted in Artificial Intelligence, Emerging Technologies, Semiconductors
Tagged AI, chatGPT, China, Huawei, LLM
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[News] TSMC SoIC Expected to Gain Major Customer with Apple Ramp-Up in 2025
According to a report from Economic Daily News, TSMC’s advanced packaging platform SoIC is said to have secured another heavyweight customer, with Apple expected to adopt the technology in 2025. If confirmed, Apple will join AMD as a major client …
[News] TSMC’s Backside Power Delivery Reportedly Set for 2026, Benefiting the Supply Chain
As semiconductor manufacturing enters the Angstrom Era, there have been significant adjustments in architecture and circuit design. To free up more surface area on chips, moving power delivery to the backside has become a mainstream consensus, making the Backside Power Delivery …