Monthly Archives: July 2024

[Insights] Memory Spot Price Update: DRAM Spot Price Finally Rises as Supply Tightens

According to TrendForce’s latest memory spot price trend report, the spot price of DRAM has finally seen a slight raise as supply for DDR4 and DDR5 tightens. Samsung has allocated more of its 1alpha nm production capacity to the manufacturing …

Posted in DRAM, NAND Flash, Semiconductors | Tagged , | Leave a comment

[News] Rise of the Non-NVIDIA Alliance Benefits Taiwanese ASIC Manufacturers

While NVIDIA is likely to face accusations from the French antitrust regulators, the Non-NVIDIA Alliance like the UALink (Ultra Accelerator Link) Alliance and the UXL Foundation are reportedly launching a counterattack, significantly increasing their efforts in developing specialized ASICs. According …

Posted in Consumer Electronics, Semiconductors | Tagged , , , , , , , | Leave a comment

[News] Memory Market Recovery is Near, as Winbond Expects a Good Year in 2025

According to a report from Commercial Times, Arthur Chiao, Chairman of Winbond, stated that this upward market cycle for the memory sector has arrived on time. Reportedly, customers are not worried about shortages, and all products made by Winbond will …

Posted in Consumer Electronics, Semiconductors | Tagged , , , , | Leave a comment

[News] HBM and Advanced Packaging Expected to Benefit Silicon Wafer

As artificial intelligence (AI) technology enjoys rapid advances, the demand for AI chips is skyrocketing, driving continuous improvements in advanced packaging and HBM (High Bandwidth Memory) technology, which is expected to benefit the silicon wafer industry. Recently, Doris Hsu, the …

Posted in DRAM, IC Manufacturing, Package&Test, Semiconductors | Tagged , , | Leave a comment

[News] Chip War Escalates: China to Enforce State Ownership of All Rare Earth Materials in October

The chip war between the U.S. and China keeps escalating, as China’s new regulation would reportedly take effect soon. This time it has a new target – rare-earth materials. According to the reports from Nikkei and Tom’s Hardware, the new …

Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , , | Leave a comment