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Recent Posts
- [News] SK hynix Rumored to Deliver Major HBM Order to Broadcom in 2025
- [News] TSMC Rumored to Begin FOPLP Production with Smaller Substrates, with Mini Lines Prepared by 2026
- [News] Kioxia Urges Bain and Toshiba to Sell Shares, Aims to Double AI NAND Market Share in Three Years
- [News] NVIDIA Reportedly Asks Super Micro to Investigate AI Chips Acquired by China Following U.S. Demand
- [News] Intel Reportedly Narrows down Bidders for Altera, with Formal Offers Due by January’s End
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Monthly Archives: July 2024
[News] Amazon Unveiled the Latest AI Chip, Performance up by 50%
According to Reuters, engineers at Amazon’s chip lab in Austin, Texas, recently tested highly confidential new servers. Per the Economic Times, the director of engineering at Amazon’s Annapurna Labs under AWS Rami Sinno revealed that these new servers feature Amazon’s AI …
[News] TSMC’s N3 Process Fuels High Demand, as Supply Chain Expected to Boom Through Next Year
According to a report from Commercial Times, TSMC’s advanced processes continue to experience strong demand, with major tech companies such as Apple, Qualcomm, NVIDIA, and AMD nearly fully booking TSMC’s 3nm capacity, while the order visibility extends into 2025. As …
Posted in Semiconductors, Wafer Foundries
Tagged 3nm, AMD, Apple, N3, Nvidia, Qualcomm, TSMC
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[News] JCET’s New High-End Packaging Plant in China Reportedly to Start Production Soon
According to a report from UDN, China’s largest semiconductor packaging and testing company, JCET, has completed the planning and verification work for the first phase of the “JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project.” The project will soon be completed …
Posted in Consumer Electronics, Semiconductors
Tagged 5G, advanced packaging, AI, China, JCET
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[News] Samsung Reportedly Emerges as a New Option other than TSMC for Chinese Clients as US Election Approaches
With the U.S.-China tech war heating up as the U.S. election approaches, industry sources cited by the Economic Daily News report that Chinese IC design companies are rushing to place more orders with TSMC for chip production using advanced processes before …
Posted in IC Design, Semiconductors
Tagged advanced process, China, IC design, Samsung, Taiwan, TSMC, US
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[News] SK hynix is Reportedly Considering U.S. IPO for its NAND/SSD Subsidiary Solidigm
South Korean memory giant SK hynix, after announcing soaring financial results in Q2 and its massive investment in Yongin Semiconductor Cluster last week, is now reportedly considering another move: US IPO for its Solidigm subsidiary. According to the reports by …