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- [News] Micron Plans HBM4 Mass Production in 2026, Customized HBM4E to Launch in 2027-2028
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- [News] Foxconn Reportedly Secures the Lion’s Share for NVIDIA’s GB300, with New Products Set to Debut in 1H25
- [News] Semiconductor Silicon Wafer and Silicon Carbide Giants Build New Plants!
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Monthly Archives: July 2024
[News] China-US Chip War Escalated as YMTC Sues Micron for Patent Infringement
According to a previous report from Bloomberg, Chinese 3D NAND Flash giant YMTC recently filed a lawsuit against American memory giant Micron in California, accusing Micron of infringing on 11 of its patents related to 3D NAND Flash and DRAM …
Posted in DRAM, NAND Flash, Semiconductors
Tagged 3D NAND, China, DRAM, memory, Micron, US, YMTC
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[News] Chinese Firms Stockpile Chips Amid Geopolitics; TSMC Sees Rush Orders
As geopolitical tensions rise, a significant increase in orders from China for TSMC was seen last quarter. According to a report from Economic Daily News, as the U.S. presidential election countdown continues, both party candidates agree on expanding semiconductor export controls …
[News] TSMC Dominates High-End Packaging Market, Potentially Impacting Opportunities for OSAT
TSMC continues to showcase its drive in the advanced packaging market. According to a report from MoneyDJ, TSMC has forecasted that CoWoS will remain in high demand through 2025, with potential for capacity to double in two consecutive years. TSMC is …
Posted in DRAM, IC Manufacturing, Package&Test, Semiconductors
Tagged advanced packaging, Amkor, ASE Group, CoWoS, FOPLP, OSAT, TSMC
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[News] OpenAI in Talks with Broadcom, Starting a AI Chip Plan with USD 7 Trillion
According to a report from The Information, generative AI application giant OpenAI has held talks with several chip designers, including Broadcom, to discuss plans for developing new AI chip. It’s reported that OpenAI is currently exploring the possibility of manufacturing …
[News] Samsung’s 2nm Node Will Reportedly Feature 30% More EUV Layers
As the industry is entering the Angstrom era with semiconductor giants eagerly applying EUV machines to the advanced nodes, more details about Samsung’s 2nm have surfaced. According to the latest report by TheElec, Samsung’s 2nm process will feature 30% more …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 2nm, 3nm, EUV, Samsung
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