Monthly Archives: August 2024

[News] Eurozone CPI Edges Up to 2.6%, with Rate Cut Expected in September

Posted on 2024-08-21 by TrendForce

Eurostat released the July CPI data for the Eurozone on August 20, showing an annual growth rate of 2.6%, slightly up by 0.1% from the previous month and in line with market expectations. The three countries with the lowest annual inflation rates …

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[News] TSMC Breaks Ground on German Plant, Looking to Establish a Semiconductor Hub in Europe

Posted on 2024-08-21 by TrendForce

According to a report from UDN, TSMC held a groundbreaking ceremony yesterday for its Dresden, Germany plant, offering a significant boost to the EU’s efforts to stabilize its chip supply. TSMC Chairman C.C. Wei led a team of top executives at …

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[News] Shanghai IC Industry Announced Two New Moves

Posted on 2024-08-21 by TrendForce

Recently, two industrial moves took place in Shanghai’s integrated circuit (IC) sector. First, the Shanghai Integrated Circuit Industry Investment Fund (Phase II) Co., Ltd. (hereinafter referred to as “Shanghai IC Industry Fund Phase II”) received a substantial capital increase. Second, …

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[News] Tech Giants’ Supply Chain Reshuffle: from China to Southeast and South Asia

Posted on 2024-08-21 by TrendForce

China has long been the preferred location for tech companies to establish their supply chains. However, in recent years, the decline in population dividends has led to rising labor costs, and the need for tech companies to mitigate the impact …

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Posted in Consumer Electronics, Notebook Computers, Semiconductors, Smartphones | Tagged , , , , , , | Leave a comment

[News] ASML Claims the World Counts on China for Legacy Chips; So Do Chip Equipment Giants

Posted on 2024-08-21 by TrendForce

As semiconductor giants, including Intel, TSMC and Samsung, have been competing fiercely in the Angstrom era for advanced nodes, the progress on their adoption of ASML’s High-NA EUV (high-numerical aperture extreme ultraviolet) equipment has been brought back into spotlight lately. …

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Posted in IC Design, IC Manufacturing, Package&Test, Semiconductors | Tagged , , , | Leave a comment