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Monthly Archives: August 2024
[News] TSMC to Break Ground on Germany Fab, with Overseas Investment Reportedly Amounting to nearly USD 100 billion
As per a report from Economic Daily News, TSMC’s first European 12-inch fab is set to hold its groundbreaking ceremony on August 20. Along with TSMC’s ongoing projects in Japan and the U.S., the investment has amounted to nearly USD 100 …
Posted in Semiconductors, Wafer Foundries
Tagged Arizona, Europe, Japan, Kumamoto, Taiwan, TSMC, US, wafer fab
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[News] Samsung Reportedly to Tape out HBM4 with 1c DRAM by Year-end
After forming a new HBM development team within its Device Solutions (DS) Division around July, memory Giant Samsung is now said to have made progress on HBM4, targeting to tape-out the product by the end of this year, a report …
[News] Samsung Reportedly Bets on CXL Memory in the AI Race
According to a report from Nikkei, Samsung Electronics, currently lagging behind SK hynix in the HBM market, is said to be betting on the next-generation CXL memory, with shipments expected to begin in the second half of this year, while anticipating the CXL …
Posted in DRAM, Semiconductors
Tagged AI chip, CXL, DRAM, HBM, Samsung Electronics, SK Hynix
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[News] U.S. Consumer Sentiment Slightly Rises in August, as Democrats Show Confidence on Harris’ Nomination
The University of Michigan released its Consumer Sentiment Index on August 16th, showing a preliminary reading of 67.8 for August, up slightly by 1.4 points from 66.4 in the previous month. The report indicates that with Kamala Harris replacing Joe …
[News] Google Launched AI-Powered Pixel 9 Series Smartphone
On August 13, Google officially released the Pixel 9 series of smartphones, featuring Google’s latest self-developed Tensor G4 processor and advanced AI function supported by Gemini AI. Google Pixel 9 series includes three full-screen smartphones: Pixel 9, Pixel 9 Pro, …
Posted in Consumer Electronics, Smartphones
Tagged 4nm, Google, Samsung, smartphone, TSMC
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