Monthly Archives: August 2024

[News] SK hynix Secures up to USD 450 Million Funding for Indiana Packaging Facility under CHIPS Act

Posted on 2024-08-07 by TrendForce

SK hynix, the current High Bandwidth Memory (HBM) market leader, announced on August 6th that it has signed a non-binding preliminary memorandum of terms with the U.S. Department of Commerce to receive up to USD 450 million in proposed direct …

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[News] ASML’s Second High-NA Equipment to be Installed in Intel’s Oregon Fab Soon

Posted on 2024-08-07 by TrendForce

Per a report from Reuters, Intel is said to be receiving the second new High-NA EUV equipment from ASML, costing EUR 350 million (~USD 383 million). According to Intel’s earnings call on August 1, CEO Pat Gelsinger stated that Intel …

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[News] Chinese Tech Giants Reportedly Stockpile Samsung’s HBM ahead of Potential U.S. Restrictions

Posted on 2024-08-07 by TrendForce

With the chip war between the two great powers heating up, the U.S. is reportedly mulling new measures to limit China’s access to AI memory. As the restrictions might be imposed as early as late August, rumor has it that …

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[News] TSMC Assigns CoW Order for the First Time, Reportedly to OSAT Provider SPIL

Posted on 2024-08-06 by TrendForce

Despite recent issues with NVIDIA’s GB200 shipments, the market remains optimistic about long-term AI demand, and CoWoS capacity continues to be in short supply. According to a report from MoneyDJ, TSMC will assign orders of the initial stage of chip …

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[News] RS Technologies to Expand Monthly Capacity of Reclaimed Wafers as its Japanese Plant Fully Booked

Posted on 2024-08-06 by TrendForce

According to a report from Nikkei on August 5, RS Technologies, a global giant in recycled wafers, has announced that due to increased orders, it will expand the monthly production capacity of its Japanese and Taiwanese plants to 580,000 wafers …

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