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Monthly Archives: August 2024
[News] Contrasting with Manufacturing, U.S. July Services PMI Rebounds into Expansion
The Institute for Supply Management (ISM) released its July Services PMI report on August 6th, revealing that the Services PMI rose from 48.8 in the previous month to 51.6, surpassing market expectations of 51.0. The expansion was driven by 10 …
[News] Signs of a Slowdown Surfaces in Automotive Chip Market Growth
Automotive chip market, previously enjoying robust growth among the semiconductor sector, is now showing signs of slowing down. According to a report from WeChat account DRAMeXchange, the major foundry UMC announced that it expects customer inventories in the communications, consumer …
Posted in IC Design, Semiconductors
Tagged automotive, NXP, semiconductor, STMicroelectronics, Texas Instruments, TSMC, UMC
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[News] ChangXin Memory Technologies in China Has Reportedly Begun Mass Production of HBM2
According to a report from Tom’s Hardware citing industry sources, it’s indicated that Chinese memory giant ChangXin Memory Technologies (CXMT) has started mass production of HBM2. If confirmed, this is approximately two years ahead of the expected timeline, although the …
[News] Foxconn Remains Unfazed Despite NVIDIA’s GB200 Delay, with Customers Aim to Secure Their Orders
According to a report from The Information, NVIDIA’s “world’s most powerful AI chip,” the GB200, is said to be experiencing yield issues, leading to a one-quarter delay in mass shipments. As per sources cited by a report from the Economic Daily …
[News] NVIDIA’s Backup Plan? Intel Reportedly Secures Packaging Orders from the AI Giant
As the demand for AI GPUs increases, TSMC’s advanced packaging capacity for CoWoS is struggling to keep up. Recently, according to a report from Commercial Times, NVIDIA has reportedly turned to Intel for advanced packaging solutions. According to industry sources cited by the same …
Posted in Semiconductors
Tagged advanced packaging, AI GPU, CoWoS, Foveros, Intel, Microsoft, Nvidia, Qualcomm, TSMC
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