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Monthly Archives: August 2024
[News] IC Design Leaders Scramble for 2nm Advantage as TSMC Launches September CyberShuttle
TSMC is set to offer a new round of its CyberShuttle prototyping service in September. According to sources cited in a report from Commercial Times, it’s revealed that, as per usual practice, there are two opportunities each year, in March …
Posted in Semiconductors, Wafer Foundries
Tagged 2nm, A16, CyberShuttle, FinFET, GAAFET, N2P, Taiwan, TSMC
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[News] U.S. Consumer Confidence Edges up in August Despite Labor Market Concerns
The U.S. Consumer Confidence Index slightly increased in August, reaching 103.3, as reported by the Conference Board on August 27. This marks a small rise of 1.4 from the previous month. Both the Present Situation Index and the Expectations Index improved …
[News] NVIDIA’s Q3 Forecast Fails to Impress, while It Claims Blackwell to Bring Several Billion Dollars Revenue in Q4
AI chip NVIDIA provided financial guidance for the third quarter, estimating its quarterly revenue to reach USD 32.5 billion, with a fluctuation of plus or minus 2%. The figure, though beats market expectations in general, still falls short of the …
Posted in Artificial Intelligence, Emerging Technologies, IC Design, Semiconductors
Tagged Blackwell, Nvidia
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[News] Two Types of Semiconductors Go Viral with the Sweeping of “Black Myth: Wukong”
Recently, “Black Myth: Wukong” created by Chinese team was released and quickly became a smash hit among game players worldwide with its stunning graphics, rich gameplay, and unique storyline. Behind this game lies the application of several cutting-edge technologies, including …
[News] SK hynix Reportedly Plans to Implement Chiplet Technology in Memory Controllers within Three Years
As designing and manufacturing large monolithic ICs became more complex, related challenges regarding yield and cost have emerged for semiconductor companies, which boosts the popularity of chiplets. Now the wave has been spreading to the memory sector. According to a …
Posted in DRAM, IC Manufacturing, Package&Test, Semiconductors
Tagged chiplet, Samsung, SK Hynix, TSMC
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