Monthly Archives: August 2024

[News] Micron to Acquire AUO Plants in Taiwan for HBM Expansion, Deal to Close by Year-End

Following TSMC’s recent acquisition of Innolux’s Tainan plant for NTD 17 billion, another Taiwanese panel maker, AUO, announced on August 27 that it will sell three idled manufacturing facilities in Tainan, Southern Taiwan as well, as memory giant Micron emerged as the buyer. Part of buildings …

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[News] Chinese Two Funds Invested a Total of CNY 8.5 Billion in IC and Semiconductor Sectors

Recently, the Zhongguancun Science City Technology Growth Phase II Fund and the Vertex Ventures China Technology Innovation Phase II RMB Fund were successively launched, with a combined investment of over CNY 8.5 billion targeting integrated circuit (IC) and semiconductor sectors. …

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[News] China’s Gallium and Germanium Export Restrictions Risk Chip Production Shortages

China’s export controls on crucial semiconductor materials are reportedly hitting the supply chain, with concerns rising over potential shortages of advanced chips and military optical hardware. According to the U.S. Geological Survey, China produces 98% of the world’s gallium and …

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[News] SK hynix Reportedly to Tape-out HBM4 in October, Paving the Way for NVIDIA’s Rubin

In mid-August, Samsung is said to be accelerating its progress on next-gen HBM, targeting to tape-out HBM4 by the end of this year. Now it seems SK hynix has maintained its competitive edge, as the company aims to tape out …

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[News] Xiaomi Reportedly to Launch In-House Processor in 2025, Manufactured with TSMC’s 4nm

According to a report from wccftech,  previous claims about Xiaomi abandoning the development of its smartphone processor due to high costs were incorrect. Instead, Xiaomi is expected to release its custom solution in the first half of 2025, with its performance rumored …

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