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Recent Posts
- [News] Foxconn Reportedly Secures the Lion’s Share for NVIDIA’s GB300, with New Products Set to Debut in 1H25
- [News] Semiconductor Silicon Wafer and Silicon Carbide Giants Build New Plants!
- [News] U.S. and Australia Seek Countermeasures, Impact of China’s Critical Material Ban Expected to Wane in the Long Run
- [News] SK hynix Rumored to Deliver Major HBM Order to Broadcom in 2025
- [News] TSMC Rumored to Begin FOPLP Production with Smaller Substrates, with Mini Lines Prepared by 2026
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Monthly Archives: August 2024
[News] Xiaomi Reportedly to Launch In-House Processor in 2025, Manufactured with TSMC’s 4nm
According to a report from wccftech, previous claims about Xiaomi abandoning the development of its smartphone processor due to high costs were incorrect. Instead, Xiaomi is expected to release its custom solution in the first half of 2025, with its performance rumored …
Posted in Consumer Electronics, Semiconductors, Smartphones
Tagged 4nm, China, N4P, smartphone, TSMC, Xiaomi
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[News] Chinese EV Maker XPeng Tapes out Latest In-House Chip, Boasting Triple the Computing Power of its Rivals
According to a report by 36Kr, China’s EV maker, XPeng Motors, has successfully completed the tape-out process for its self-developed intelligent driving chip. Sources cited by the report further reveal that XPeng’s intelligent driving chip is specifically designed to meet …
Posted in Automotive Technologies, Emerging Technologies
Tagged AI, AutonomousDriving, EV, Marvell, NIO, XPeng
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[News] China’s Industrial Profits Continue to Rise in July, But Domestic Demand Remains Weak
China’s industrial profits continued to rise in July, as reported on August 27. According to the National Bureau of Statistics, the cumulative year-on-year growth rate of profits for large-scale industrial enterprises reached 3.6% from January to July, an increase of …
[News] Chinese Rivals Said to Recruit Samsung’s Advanced Packaging Business Leader after the Unit Disbanded
Amid the AI boom driving a surge in demand for advanced packaging, Samsung Electronics announced in March its ambition to achieve record-high revenue for the business this year, aiming to surpass the USD 100 million mark. The company, which is eager to …
Posted in Semiconductors, Wafer Foundries
Tagged advanced packaging, CoWoS, Samsung, TSMC
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[News] Kioxia’s IPO Paves the Way for SK Hynix to Secure Funds for HBM Investment
Kioxia has moved forward with its plans to go public, starting the process on August 23. This development follows Bain Capital, a U.S. private equity firm with a majority stake in Kioxia, submitting an application for the listing to the …